Lead Engineer - Electronics & Mechanical Packaging

Wabtec•Erie, PA

34d•$62,100 - $85,300•Onsite

About The Position

The Lead Engineer is part of the Electronics Hardware team and is responsible for the mechanical design aspects of power and control electronic products used in locomotives and surface mining trucks. The Packaging Engineer works with a cross-functional team to integrate complex circuit card assemblies, discrete components, and interconnect devices into a mechanical enclosure design that meets the challenging physical, performance, thermal, and environmental requirements of the project. Responsibilities also include thermal analysis, stress analysis, validation testing and manufacturing support of the packaged assembly.

Requirements

Bachelor’s degree in Mechanical Engineering. Masters preferred.
Minimum of 3 years of experience in mechanical packaging design for electronic control and power supply assemblies.
Strong proficiency in 3D CAD (Siemens NX/Unigraphics preferred) and simulation tools for stress and thermal analysis (e.g., ANSYS, Icepak, CFD).
Experience integrating rigid, flexible, and rigid-flex PCBs into mechanical assemblies, including knowledge of electrical connectors, interconnects, and EMC design best practices (grounding/shielding).
Solid understanding of material properties, sheet metal design, welding methods, and thermal management techniques (active and passive cooling).
Proven experience launching electronic products into production, including Design for Manufacturing (DFM), Design for Test (DFT), and Design to Cost (DTC), with familiarity in high-voltage power supply and inverter packaging.
Willingness and ability to travel up to 10%

Responsibilities

Work closely with the electrical and system engineers to design and model complex electronic assemblies involving the integration of PCBs and interconnects with a mechanical enclosure and parts.
Design electronic enclosures and optimize panel architecture to meet project goals for performance, testability, manufacturability, and cost.
Research/select connector and interconnect devices based on project requirements and vendor options.
Apply industry best practices for ruggedized electronics, including but not limited to thermal management, EMC, shock and vibration.
Create finite element models to simulate load cases and predict structural, fatigue, and dynamic characteristics of new products.
Perform detailed thermal simulation of electronic assemblies to predict operating temperatures under various conditions. Conduct thermal mitigation tradeoff studies, often involving active and/or forced air cooling.
Analyze detailed mechanical assembly characteristics, such as bolted joints, tolerance stack ups, and GD&T.
Prepare and release design documentation (e.g. drawings, calculations, bills of material, and purchase specifications).
Conduct technical design reviews with internal and external customers.
Support the organization with vendor selection, production launch and PPAP documentation.
Lead and execute the validation and qualification of new products, components, and assemblies, with focus on mechanical and thermal performance, and electrical functional tests.
Work with the team to resolve challenging technical issues through creativity and innovation.
Support multiple work assignments with shifting priorities and quickly pivot design direction as new information arises.