Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) HBM Architecture team develops future High-Bandwidth Memory (HBM) architectures, PHY design methodologies, and automation solutions that enable next-generation AI, high-performance computing, networking, and data center applications. The team works closely with Architecture, Design Engineering, Verification, Product Engineering, and external partners to advance memory technologies while improving design quality, productivity, and development efficiency.
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Job Type
Full-time
Career Level
Intern