Intern, NPI Packaging Engineer - Fall 2026

Murata America • San Diego, CA

3d • $32 - $58 • Onsite

About The Position

This position assists with design and prototype assembly of new RFIC products during the product development phase. This position must enjoy working in a fast-paced environment while maintaining a sense of commitment and be flexible to project needs. We are looking for a collaborative team member who possesses a sense of urgency to meet product requirements on schedule.

Requirements

• Hands on experience with design tools such as AutoCAD.
• Familiarity with DOE methodology.
• Ability to present technical information to technical personnel.
• Demonstrated ability to collect accurate experimental data, basic data analysis and plotting for presentation to others.
• Basic understanding of robot machinery.

Nice To Haves

• Hands on experience with manufacturing equipment and processing.
• Excellent verbal and written communication skills.
• Strength in documentation clarity and completeness.
• Cooperative team member with a strong sense of urgency to meet product requirements on schedule.
• Willingness to go beyond what’s required.

Responsibilities

• Participates with design of bump, package, and assembly process flow for new products for use in high volume, high reliability, industrial, commercial, and automotive applications and will use data analysis to drive most decisions.
• Prepares design documentation and bill of materials for both chip fabrication, backend wafer processes, and component assembly.
• Execution of DoE experiments collecting characterization data to substantiate design decisions and mitigate technical risk to new products in development.
• Supports failure analysis and problem resolution in the development process or production environment.

Benefits

• pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees.

What This Job Offers

• Job Type: Full-time
• Career Level: Intern