Corning is seeking an Image Analysis Intern for Summer 2027. Deep UV (DUV) photolithography relies on glass and crystalline optics that remain highly transparent under 193 nm laser irradiation. Increasing laser power and microscopic material defects can contribute to surface or bulk damage, shortening the lifetime of optics used in semiconductor process tools. The intern will develop an image analysis algorithm to quantify surface damage on crystalline DUV optics after laser irradiation. After benchmarking the algorithm, the intern will apply it to historical laser damage images and correlate extracted damage features with measured laser damage threshold, lifetime, and laser fluence. The work is intended to improve understanding of laser-induced damage mechanisms. The intern will document the methodology and findings in a report or poster presentation and work with engineers and scientists to refine the approach. The program includes competitive salaries, housing assistance, travel reimbursement, social and networking events, volunteer opportunities, and community involvement. The position requires availability for 10 weeks during May–August 2027 and does not support immigration sponsorship. The pay range is $1,635.00–$3,185.00 biweekly; starting pay is determined by geographic location, position nature, and year in school.
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Career Level
Intern
Education Level
No Education Listed