At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. AMD is looking for an engineering leader passionate about driving the best Power, Performance, Area (PPA) of AMD’s SoC coherent Interconnects Data Fabrics IPs for next generation AMD AI devices. The ideal candidate will have proven experience in developing scalable complex digital IP microarchitectures to deliver industry leading performance/area and performance/power. In this role the candidate will work with IP and SOC Architecture team, RTL design team, verification team, and physical design team to drive the RTL design and microarchitecture of modular network on chip IPs for AMD Data Center silicon SoCs. The candidate will drive new methodologies to build scalable, modular network on chips. You will be a member of a core team of incredibly talented industry specialists and will work with the latest and rapidly evolving hardware technologies for AMD Data Center SoCs.
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Job Type
Full-time
Career Level
Senior