Integration Engineer

Analog Devices•Beaverton, OR

12d•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. The Process Integration Team is seeking an Integration Engineer to join a collaborative and highly technical group of 10-12 engineers with diverse backgrounds and expertise. This team partners closely with process module engineering organizations to identify, troubleshoot, and resolve manufacturing and quality challenges across the semiconductor fabrication process. Team members gain broad exposure to silicon-based semiconductor products, supporting all stages of production from starting silicon through wafer fabrication, assembly, and final packaged die. The role offers a unique opportunity to develop a comprehensive understanding of semiconductor manufacturing while driving yield, quality, and process improvements.

Requirements

BS or MS in Electrical Engineering or associated engineering field with semiconductor device background
0-3 years of experience working in a cleanroom environment
Understanding of CMOS and Bipolar Junction Transistor structures and device operation
Knowledge of how process variables influence electrical characteristics of CMOS and BJT devices
Ability to work in a team environment with strong written and verbal communication skills
Basic understanding of operation of common semiconductor process operations: Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation and Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA)

Nice To Haves

Knowledge of Statistical Process Control (SPC)

Responsibilities

Interpreting and responding to electrical signals from Si-based semiconductor devices and establishing connections to process conditions
Leading teams of process module engineers to resolve yield and parametric problems
Optimization of semiconductor manufacturing processes to improve productivity and/or quality
Interpretation of SEM, TEM, and EDX analysis to establish root cause of electrical signals in semiconductor devices
Transfer of Si semiconductor processes between manufacturing facilities and to larger wafer diameter in the same facility
Teamwork with Product and Defect engineering to identify yield limiters for yield improvement