Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies. Northrop Grumman Mission Systems is looking for you to join our team as an Industrial Engineer for our Advanced Packaging Technology µ-Line based in Apopka, Florida. Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development. The Apopka Florida wafer bumping µ-Line supports flip chip, 2.5D, and 3D packaging for internal and external production customers as well as emerging technology programs. The line provides a range of bump compositions and processes that include photo, sputter, electro-plating, AOI, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing. The Industrial Engineer is an integral part of the day-to-day operations and routinely works alongside engineering, production and many other organizations here in Apopka, FL. This is a team that comes together to learn, collaborate, and overcome challenges in a fast-paced environment. We are looking for applicants that enjoy working and learning from their peers and are passionate about making a positive difference.
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Job Type
Full-time
Career Level
Mid Level