Implant Equipment Engineer - Anneal/Surface Treatment

Samsung•Taylor, TX

1d•Onsite

About The Position

In your role as an Equipment Engineer you'll work to support equipment and process capabilities of 300mm tools for the Implant department. You will be a part of a team that focuses on keeping tools running at peak efficiency and drive yield improvements, reduce defects, cut operating costs, and implement continuous‑improvement initiatives across a 24×7 manufacturing environment.

Requirements

BS degree in Electrical, Chemical, Physics, or Mechanical Engineering or related field of study
2+ years of semiconductor experience highly desired with knowledge of Thermal Anneal(RTP) or Surface Treatment/Dry Etch processes and equipment.
Experience with troubleshooting Equipment or Process failures.
Experience with tool installation and setup.
Understanding of statistical methods Structured Problem-Solving (8D, 7-step, etc..) ability.
Able to wear clean room suit and Personal Protective Equipment (PPE) and to lift < 35 lbs.
Able to work in FAB environment and sitting at a computer terminal for extended periods of time
May be exposed to yellow lights, blinking lights
Ability to discern audible alarms

Nice To Haves

Experience with any of the following tools preferred. AMAT Centura/Radiance/DPN/DPX/DSA/Ajax Mattson Millios/Suprema/Escala LAM Argos Semes HPA/LOHAS Veeco LSA

Responsibilities

Observe real‑time tool performance; identify and resolve issues (mechanical, electrical, pneumatic, defects).
Respond to alarms and perform recovery plans with technicians.
Use software to analyze data, identify root causes, and make decisions about processing product.
Lead new tool qualification.
Schedule and coordinate equipment maintenance and coordinate downtime with manufacturing team.
Execute Change‑Point Management (CPM).
Revise and maintain SOPs, record daily tool activity, and capture lessons learned.
Communicate technical updates via presentations to cross‑functional teams.
Monitor operational costs and lead projects for cost‑reduction.
Document and track performance metrics (yield, throughput, particle counts).