About The Position
As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.
Requirements
- BS and a minimum of 10 years relevant industry experience or equivalent
Nice To Haves
- BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred
- Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.
- Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).
- Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python.
- Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.
- Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.
- Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.
Responsibilities
- Drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages.
- Pioneer new characterization methodologies.
- Evaluate state-of-the-art packaging materials.
- Solve complex yield and reliability challenges to ensure components meet uncompromising standards for performance and robustness.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
