IC Packaging Engineer, Materials and Packaging Characterization

Apple

2h

About The Position

As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.

Requirements

• Minimum requirement of a bachelors degree

Nice To Haves

• BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred
• Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.
• Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).
• Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python.
• Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.
• Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.
• Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.

Responsibilities

• Drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages.
• Pioneer new characterization methodologies.
• Evaluate state-of-the-art packaging materials.
• Solve complex yield and reliability challenges to ensure components meet uncompromising standards for performance and robustness.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees