IC Package Mechanical FEA Engineer (R&D)
About The Position
Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc..
Requirements
- Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.
- Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions
- Ability to calibrate modeling and results with existing empirical data
- Perform mechanical testing and measurement
- Devise lab scale tests to validate analyses
- Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
- Presentation and technical documentation skills
Nice To Haves
- Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK
Responsibilities
- Design responsibility for mechanical design aspects of ASIC packages
- Use advanced FEA to quantify and optimize reliability and manufacturing
- Measure and experiment to validate understanding and improve model accuracy
- Collaborate closely with package designers, reliability and manufacturing partners (internal and external)
- Schedule, prioritize, & track your work across 4+ projects simultaneously
- Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors
- Document design rules and guidelines
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave and vacation time
- Paid Family Leave
- other leaves of absence
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What This Job Offers
Job Type
Full-time
Career Level
Senior
