viaPhoton is seeking a High-Speed Digital Design Engineer to advance development of 200G+ systems and interfaces for next-generation NPO and Co-Packaged Optics (CPO) products. The role owns the high-speed electrical data path from concept through production and involves hands-on signal and power integrity work for AI data center connectivity. The engineer will guide and mentor junior design team members. Responsibilities include advancing 224G/448G PAM4 signal and power integrity, selecting technology and defining architecture, developing and integrating CPO solutions, and bringing products to production. The role also involves defining PCB materials and stack-ups; evaluating S-parameters, eye diagrams, crosstalk, jitter, and COM performance; and assessing host and optical technologies, compute fabrics, and scale-up/scale-out topologies. The position is onsite in Naperville, Illinois, Monday through Friday. Compensation is $80,000–$150,000 base salary, plus an annual bonus.
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Job Type
Full-time
Career Level
Mid Level