High-Speed Digital Design Engineer

viaPhoton•Naperville, IL
•$80,000 - $150,000•Onsite

About The Position

viaPhoton is seeking a High-Speed Digital Design Engineer to advance development of 200G+ systems and interfaces for next-generation NPO and Co-Packaged Optics (CPO) products. The role owns the high-speed electrical data path from concept through production and involves hands-on signal and power integrity work for AI data center connectivity. The engineer will guide and mentor junior design team members. Responsibilities include advancing 224G/448G PAM4 signal and power integrity, selecting technology and defining architecture, developing and integrating CPO solutions, and bringing products to production. The role also involves defining PCB materials and stack-ups; evaluating S-parameters, eye diagrams, crosstalk, jitter, and COM performance; and assessing host and optical technologies, compute fabrics, and scale-up/scale-out topologies. The position is onsite in Naperville, Illinois, Monday through Friday. Compensation is $80,000–$150,000 base salary, plus an annual bonus.

Requirements

  • Bachelor of Science in Electrical Engineering.
  • At least 3 years of hands-on high-speed design experience.
  • Background in high-speed transceiver or transponder development, ideally for 200G/PAM4+ interconnect.
  • Experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related OIF-CEI or IEEE standards.
  • Knowledge of high-speed signaling fundamentals, channel behavior, PCB technologies, and RF design techniques.
  • Comfort with SI simulation tools such as ADS or HFSS, and with EMI/EMC evaluation and mitigation.

Responsibilities

  • Advance development of 200G+ systems and interfaces for NPO and CPO products, including 224G/448G PAM4 signal and power integrity.
  • Own technology selection, architecture, development, integration, and productization of CPO solutions.
  • Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance.
  • Assess host technologies, including switch fabric and xPU, and optical technologies, compute fabrics, and scale-up/scale-out topologies.
  • Guide the electrical data path from concept to production.
  • Guide and mentor junior design team members.

Benefits

  • Health insurance coverage starting on day one
  • Dental insurance coverage starting on day one
  • Vision insurance coverage starting on day one
  • 401(k) with matching; match vests immediately after a 90-day waiting period
  • Flexible PTO that grows over time
  • 10 paid holidays, including 2 floating holidays
  • Monthly team events
  • Annual bonus
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