We are looking for an enthusiastic student to work in the R&D process group within the Advanced Packaging and Integration Team to contribute to the development of our Optical Circuit Switch (OCS), which brings a new level of scalability, latency, and power efficiency to cloud‑scale and AI/ML data center networks. Built on field‑proven Lumentum micro‑electro‑mechanical systems (MEMS) technology with over a trillion mirror operating hours, the OCS establishes direct optical paths between endpoints—eliminating intermediate packet processing and optical‑electrical‑optical (OEO) conversion. The result is dramatically lower latency, higher signal integrity, and significant reductions in network power for large GPU clusters. This is an excellent opportunity to work in a truly multi-disciplinary environment and to learn about the product development process at Lumentum. In this position, students will be engaged in the development and execution of package assembly, integration, and sealing processes involving materials science, thermal design and process control considerations. This position also offers the opportunity to contribute to the process improvements with tools, standard operating procedures and process automation, enhanced data collection/storage and examination as well as R&D analysis tools. Students will collaborate with other Engineering teams throughout their work term, including Hermetics and Advanced Packaging and Integration, Manufacturing, and Mechanical and Software teams. This will give them a broad overview of the many disciplines involved in the design of our products. The role is very flexible in projects and focus areas, which will allow students to have some control over what they get out of this experience.
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Career Level
Intern