Hardware Engineering Technical Leader
About The Position
As a Senior Photonics Packaging Engineer on the Acacia Packaging Engineering team, you will join a multidisciplinary group of optical, mechanical, electrical, and manufacturing engineers focused on developing next-generation optical communication products. In this role, you will work closely with Acacia's Silicon Photonics (PIC) development team to drive new product designs and collaborate with Product Engineering and Quality teams to ensure seamless transfer into manufacturing. You will play a critical role in the design, development, qualification, and production ramp of advanced transceivers that leverage silicon photonics and ground breaking DSP technology. The position also involves resolving technical challenges encountered during prototyping, product qualification, and high-volume manufacturing while driving solutions that deliver exceptional performance, reliability, cost efficiency, scalability, and manufacturability.
Requirements
- Bachelor’s degree in Physics, Mechanical Engineering, Materials Science, or a related field with 12+ years of experience, or Masters + 8 years of related experience, or PhD + 5 years of related experience
- 8+ years of experience in back-end wafer processing, with expertise in materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes.
- Experience managing overseas contract manufacturers, leading cross-functional teams to resolve manufacturing issues, and delivering consistent results in high-volume production environments.
Nice To Haves
- Knowledge of silicon photonics (SiPh/PIC) packaging, including mechanical, thermal, optical, and RF design considerations.
- Experience in the design, development, and manufacturing of silicon photonics optoelectronic multi-chip module (OE-MCM) packaging.
- Expertise in transceiver optical assembly processes, including free-space optics and fiber-optic assembly techniques, with a focus on scalable manufacturing solutions.
- Experience in leading cross-functional, multidisciplinary teams in fast-paced, collaborative development environments.
- Familiarity with the operating principles of photonic devices used in coherent optical communication systems is an advantage.
- Excellent verbal and written communication skills, with the ability to effectively collaborate across technical and business teams.
Responsibilities
- Lead technical ownership of optical transceiver assembly process development, with a focus on silicon photonics packaging using advanced manufacturing technologies.
- Develop high-volume, highly automated, and cost-effective manufacturing processes that meet performance, scalability, reliability, and cost objectives.
- Drive the development and optimization of 2D/2.5D/3D wafer-level packaging processes, including flip-chip wafer-level bonding, Cu pillar (CuP), C3/C4 bumping, and Through-Silicon Via (TSV) integration.
- Design and implement Design of Experiments (DOE) to optimize process capability, throughput, yield, and operating windows, while leading technology transfer to manufacturing and contract manufacturers through comprehensive documentation and operational handoff.
- Serve as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment, including software integration and electronic hardware interfaces.
- Partner cross-functionally with design, test, reliability, and manufacturing teams to improve product manufacturability, testability, quality, and production readiness.
Benefits
- medical
- dental
- vision insurance
- 401(k) plan with a Cisco matching contribution
- paid parental leave
- short and long-term disability coverage
- basic life insurance
- 10 paid holidays per full calendar year
- 1 floating holiday for non-exempt employees
- 1 paid day off for employee’s birthday
- paid year-end holiday shutdown
- 4 paid days off for personal wellness
- 16 days of paid vacation time per full calendar year (non-exempt employees)
- flexible vacation time off program (exempt employees)
- 80 hours of sick time off provided on hire date and each January 1st thereafter
- up to 80 hours of unused sick time carried forward from one calendar year to the next
- Additional paid time away may be requested to deal with critical or emergency issues for family members
- Optional 10 paid days per full calendar year to volunteer
- annual bonuses (for non-sales roles)
- performance-based incentive pay (for sales roles)
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What This Job Offers
Job Type
Full-time
Career Level
Senior
