Hardware Engineering Intern, BS/MS, Summer 2027

Google•Durham, NC

17h•$86,000 - $115,000•Onsite

About The Position

Google is an engineering company that hires individuals with broad technical skills to tackle significant technological challenges and impact millions or billions of users. The specific team placement depends on business needs, with potential teams including Platforms Infrastructure Engineering and Devices and Services. The AI and Infrastructure organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all Google services and Google Cloud. They focus on security, efficiency, and reliability, shaping the future of hyperscale computing and developing AI platforms like Vertex AI. As a Hardware Engineering Intern on the Platforms Infrastructure Engineering team, you will contribute to designing and building the hardware and software technologies that power Google's services, utilizing custom-designed in-house hardware for complex computational challenges. The Devices and Services team aims to transform computing by creating innovative first-party devices and services that showcase the best of Google. They foster a positive work environment, lead with AI-first experiences, and drive silicon innovation. Their mission is to make user interaction with computing faster, seamless, and more powerful through research, design, and development of new technologies and hardware, improving how users capture and sense the world, advancing form factors, and enhancing interaction methods. Google engineers are instrumental in revolutionizing search, developing massive scalability and storage solutions, large-scale applications, and new platforms for developers worldwide, impacting products like Google Ads, Chrome, Android, and YouTube.

Requirements

Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Computer Science, or a related technical field.

Nice To Haves

Currently attending a degree program in the US and available to work full time for 12 weeks outside of university term time.
In their penultimate academic year or returning to a degree program after completion of the internship.
Experience in one or more of the following areas: hardware system integration (board design, board bring-up), signal and power integrity, system validation, product design (mechanical/thermal), computer architecture, FPGAs, embedded systems, or memory systems (FEA or CFD), modeling or simulation for power/thermal analysis, or prototyping, testing, and debugging of data center systems in a lab environment.
Experience with data center systems, consumer electronics or device manufacturing.
Experience in one or more of the following areas: board layout (e.g., working with CAD/PCB design), CAD tools (e.g., NX, Creo, or Solidworks), systems integration.
Familiarity with electromechanical assemblies, manufacturing techniques, fabrication techniques, or rapid prototyping or technical subsystems such as wireless, antenna, radio frequency, imaging, display, sensors, audio, charging power, or batteries.