Global Product Support Engineer 3

Lam Research•Tualatin, OR

7d•Hybrid

About The Position

The Global Products Group is dedicated to excellence in the design and engineering of Lam’s etch and deposition products, driving innovation to solve the biggest challenges in the semiconductor industry. As a Global Product Support Engineer, you will be the backbone of technical support for field engineers, technicians, and product support personnel. Your expertise will be crucial in diagnosing, troubleshooting, repairing, and debugging complex semiconductor equipment. Your swift action in responding to situations is critical in resolving issues and ensuring the satisfaction of Lam’s valued customers.

Requirements

Minimum of 5 years of related experience with a Bachelor’s degree; or 3 years and a Master’s degree; or a PhD without experience; or equivalent work experience.

Nice To Haves

20% - 30% travel internationally (sometimes includes last minute travel to address customer concerns)

Responsibilities

Provides technical support to field engineers, technicians, and product support personnel who are diagnosing, troubleshooting, repairing and debugging complex electro/mechanical equipment, computer systems, complex software, or networked and/or wireless systems.
Responds to situations where first-line product support has failed to isolate or fix problems in malfunctioning equipment or software.
Reports design, reliability and maintenance problems or bugs to design engineering/software engineering.
May be involved in customer installation and training and provides support to customer/users where the product is highly technical or sophisticated in nature.
Collaborates with other Lam Research colleagues and teams to ensure quality of product and designs and deliverables for customers.
Delivers presentations to external customers to address customer concerns and create projects to resolve and improve the product performance and experience.
Works independently and with team to troubleshoot, problem solve, address productivity and CIP project.