We are seeking a Focal Plane Packaging Engineer to help create the “eyes” of the next generation of space payloads by developing and building state‑of‑the‑art electro‑optical (EO) focal plane subsystems for space‑based applications. In this role, you will execute advanced, precision assembly and microelectronic packaging processes for focal planes that operate at the intersection of optical physics, advanced materials science, high‑speed electronics, and cryogenic thermal management. Success requires cross‑disciplinary integration across mechanical, thermal, electrical, and optical interfaces, as well as rigorous adherence to quality and configuration‑control standards. The selected candidate will work in a highly controlled cleanroom environment to manufacture space‑flight hardware and contribute directly to mission‑critical capabilities across Civil, Defense, and Tactical space programs. This position is for a Focal Plane Packaging Engineer and will report to the Detector Technology Center of the Payload Engineering department within the Engineering, Science and Analysis (ESA) Strategic Capabilities Unit of BAE Systems Space and Missions Systems (SMS). The Engineering, Science and Analysis (ESA) Strategic Capabilities Unit comprises the technical talent and organizational leadership that enables the successful delivery of high-impact discriminating technologies for our customers’ missions. Our collaborative, cross-functional teams are committed to innovation, integrity, continual learning and strong execution.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED