About The Position

NXP's Global Sales organization is seeking to transform its intelligent edge vision into meaningful market impact by hiring for the Technical Sales & Applications Program (TSAP). This early-career development program is designed for new college graduates pursuing customer-facing technical roles, with a focus on driving success in the Industrial, IoT, and Automotive markets. TSAP prepares participants for a long-term career as Field Application Engineers (FAEs) through a combination of structured learning and on-the-job experience over 9-12 months. The program includes learning semiconductor and system fundamentals, NXP product portfolios, embedded systems and software, and business fundamentals, alongside hands-on experience with experienced FAEs, TSEs, technical product teams, NXP partners, and customers. Upon completion, participants transition into a permanent FAE role within the Americas Sales organization. The FAE serves as a field specialist, providing technical guidance and support on NXP solutions, specializing in areas like Microcontrollers, Applications Processors, Wireless, or Security. FAEs identify new projects, propose technical solutions, and build trustworthy relationships with customers by offering real-time technical support, directly contributing to revenue growth.

Requirements

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
  • Graduate in past 24 months or upcoming graduate.
  • Minimum GPA of 3.0 or higher.
  • Passion for electronics, and embedded MCU/MPU software for robotics applications, including real-time control, motor control, sensor integration, edge AI, and Linux- or RTOS-based system development.
  • Foundational understanding of analog and digital circuits, embedded systems, microcontrollers, processors, semiconductor applications, and software development skills in C, C++, Python, or similar languages.
  • Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards, and common lab tools.
  • Strong problem-solving and analytical skills, with the ability to learn new technologies quickly.
  • Good written and verbal communication skills, with the confidence to explain technical concepts to different audiences.
  • Ability to work effectively in a collaborative, cross-functional, and customer-focused environment.
  • Self-motivated, curious, and eager to develop both technical expertise and business acumen.
  • Experience presenting technical work through class projects, internships, research, competitions, or student organizations.
  • Demonstrated leadership, teamwork, or campus involvement through engineering teams, competitions, or technical societies.
  • Internship, co-op, or project experience in applications engineering, design engineering, embedded software, technical sales, or customer support.
  • Willingness to relocate to Austin and travel primarily within the North America.

Nice To Haves

  • Familiarity with ARM-based embedded systems, RTOS basics, or Linux embedded development.
  • Exposure to embedded software development or debugging through academic or hands-on projects.
  • Exposure to robotics software, motion control, or sensor integration concepts.
  • Familiarity with common embedded communication interfaces such as UART, SPI, I2C, CAN, USB, or Ethernet.
  • Exposure to basic real-time control or motor-control concepts.
  • Exposure to sensing, perception, or sensor-fusion concepts for robotics or edge systems.
  • Familiarity with edge AI or embedded ML.
  • Awareness of embedded security, safety, and reliability concepts.

Responsibilities

  • Provide technical leadership to sales teams and customers covering NXP portfolio (e.g., MCU/MPU selection, bring-up, and software stack integration).
  • Lead proof of concept development, product evaluations, debug activities, integration efforts, lab validation and basic system-level troubleshooting using oscilloscopes, current/voltage probes, power analyzers, and software debug/trace tools.
  • Design support through schematic and PCB reviews.
  • Prepare and deliver technical presentations, demonstrations and training materials with guidance from senior engineers.
  • Collaborate with sales, marketing, product management and engineering teams to communicate customer needs and support business opportunities.
  • Drive enablement initiatives by communicating customer feedback, identifying gaps in collateral, and partnering with product lines to improve tools, software, and documentation.
  • Represent NXP technology at customer meetings, workshops, partner and industry activities.

Benefits

  • Structured learning and on-the-job experience
  • Early-career development program
  • Preparation for a long-term career as Field Application Engineers (FAEs)
  • Opportunity to work with customers shaping tomorrow's world
  • Exposure to cutting-edge AI and intelligent edge technologies
  • Competitive and high-ownership environment
  • Potential for rapid growth and achievement
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