Failure Analysis Technician (Night Shift -B)

Coherent•Sherman, TX

5d•Onsite

About The Position

The Failure Analysis Technician performs advanced microscopy and materials characterization to support semiconductor and photonic device failure investigations, product and process reliability, new product introductions, yield improvement, and customer return investigations. The role operates a Helios Dual-Beam Focused Ion Beam (DBFIB) system for precision cross-sectioning, defect localization, delayering, circuit-editing support, and structural characterization. It also prepares TEM lamella specimens using in-situ and ex-situ lift-out techniques, including thinning and final polishing for high-resolution TEM analysis, and conducts SEM imaging and EDS elemental analysis. The technician operates a TEM to evaluate device structures, interfaces, process defects, contamination, and failure sites; analyzes microscopy results; and prepares reports with images, measurements, observations, and technical conclusions. The technician supports Failure Analysis Engineers with analytical approaches and characterization technique selection, performs sample preparation such as cleaving, polishing, mounting, and coating, and contributes to root-cause investigations. The position also includes maintaining laboratory equipment and documentation, following established procedures and identifying workflow improvements, and training or assisting technicians and engineers as assigned. The role works for extended periods in a Class 10,000 cleanroom, requires cleanroom attire and PPE, and involves working with or around chemicals including IPA and acetone. Employees must follow site and corporate EHS standards, attend scheduled safety training, and use required protective equipment. Depending on location, the role may support applicable quality and environmental management standards. The position is expected to uphold Coherent Corp.’s ICARE values.

Requirements

Associate degree in Electronics, Materials Science, Engineering Technology, Physics, Chemistry, Microscopy, or a related technical field and 2 or more years of relevant experience; alternatively, 4 or more years of directly applicable experience in semiconductor failure analysis, microscopy, materials characterization, or a related laboratory environment.
Hands-on experience operating Focused Ion Beam (FIB) or Dual-Beam FIB (DBFIB) systems.
Ability to interpret SEM, TEM, EDS, and FIB-generated data and communicate observations clearly.
Strong mechanical aptitude and manual dexterity for handling delicate samples and performing precision sample preparation.
Ability to work with sub-micron features and maintain close attention to detail when preparing and analyzing specimens.
Proficiency with Microsoft Office applications and technical report generation.
Ability to manage multiple investigations simultaneously and prioritize work effectively.
Strong written and verbal communication skills.
Strong interpersonal skills and ability to collaborate with departmental and cross-functional teams.
Ability to grasp, manipulate, and position very small objects, approximately 85 µm in diameter, using tweezers and other precision tools.
Close visual acuity for preparing and analyzing data, viewing microscopic images, inspecting small parts and defects, operating precision positioning probes, and using measurement devices.
Ability to distinguish colors to identify defects, features, or conditions on parts and materials.
Ability to communicate detailed instructions effectively in spoken English and hear and interpret oral information at normal speaking levels, with or without correction.
Ability to work at a microscope while bending forward for periods of up to one hour at a time.
Ability to perform sedentary work, sitting and/or standing for up to four hours at a time at a workstation, microscope, or solvent hood.
Ability to walk within the facility for distances up to approximately 500 meters, sometimes wearing protective footwear or shoe covers.
Ability to lift, carry, or move objects weighing up to 25 pounds over short distances.
Ability to ascend and descend stairs and ladders, and occasionally kneel or crouch to reach items.
Ability to perform precision manual probing with both hands and arms for periods of up to one hour at a time.
Ability to work safely around potential hazards, including moving mechanical parts and chemicals.
Ability and willingness to wear required cleanroom attire, gowns, and PPE for periods of up to four hours at a time.
Follow applicable safety precautions, including required protective equipment for chemicals, wafers and parts, high-power testing, liquid nitrogen, sharp parts, and chemical handling.

Nice To Haves

Experience preparing TEM lamellae using in-situ lift-out techniques.
Experience operating Scanning Electron Microscopes and performing EDS elemental analysis.
Experience operating or supporting Transmission Electron Microscopes.
Working knowledge of semiconductor device structures, thin-film materials, metallization systems, and failure mechanisms.
Experience with image processing and annotation software such as Photoshop, ImageJ, or equivalent.
Experience working in cleanroom, laboratory, or semiconductor manufacturing environments.

Responsibilities

Operate a Helios DBFIB system for precision cross-sectioning, defect localization, delayering, circuit-editing support, and structural characterization of semiconductor and photonic devices.
Prepare high-quality TEM lamella specimens using in-situ and ex-situ lift-out techniques, including thinning and final polishing for high-resolution TEM analysis.
Perform SEM imaging and EDS elemental analysis to characterize materials, contamination, defects, interfaces, and failure mechanisms.
Operate a TEM to evaluate device structures, material interfaces, process defects, contamination, and failure sites.
Analyze and document microscopy results in clear reports containing images, measurements, observations, and technical conclusions.
Support root-cause investigations through physical characterization of product, process, and reliability failures.
Perform sample preparation, including cleaving, polishing, mounting, coating, and other techniques needed for analytical investigations.
Assist Failure Analysis Engineers in developing analytical approaches and selecting characterization techniques for complex investigations.
Maintain laboratory equipment, fixtures, consumables, and documentation to support safe and reliable operation.
Follow established procedures and identify opportunities to improve laboratory efficiency, sample preparation methods, and analytical workflows.
Train and assist other technicians and engineers on sample preparation methods, microscopy techniques, and laboratory best practices as assigned.
Support new product introductions, reliability studies, yield improvement initiatives, and customer return investigations through advanced microscopy and materials characterization.
Attend scheduled safety training and follow site EHS procedures, Corporate EHS standards, and applicable PPE requirements.
Depending on location, execute or maintain applicable quality and environmental management standards.