Failure Analysis Technician (Night Shift -B)

Coherent Corp.•Sherman, TX

About The Position

The Failure Analysis Technician performs advanced microscopy and materials characterization to support semiconductor and photonic device investigations. The technician operates a Helios Dual-Beam Focused Ion Beam (DBFIB) system for precision cross-sectioning, defect localization, delayering, circuit-editing support, and structural characterization. The role also prepares TEM lamella specimens using in-situ and ex-situ lift-out techniques, including thinning and final polishing, and performs SEM imaging, EDS elemental analysis, and TEM evaluation of device structures, interfaces, defects, contamination, and failure sites. The technician documents microscopy results in clear technical reports containing images, measurements, observations, and conclusions, and provides physical characterization to support root-cause investigations of product, process, and reliability failures. The role includes sample preparation, laboratory equipment and consumables upkeep, following and improving laboratory procedures and workflows, and assisting Failure Analysis Engineers with analytical approaches. The technician also trains or assists colleagues as assigned and supports new product introductions, reliability studies, yield improvement, and customer-return investigations. The position works for Coherent Corp. in a Class 10,000 cleanroom for extended periods, wearing cleanroom attire and working with or around chemicals such as IPA and acetone. Employees must follow site and corporate EHS procedures, attend required safety training, and use required personal protective equipment. Depending on location, the position may also be responsible for executing and maintaining applicable quality and environmental management standards, including ISO 9000, 9001, and 14001.

Requirements

Associate degree in Electronics, Materials Science, Engineering Technology, Physics, Chemistry, Microscopy, or a related technical field plus 2 or more years of relevant experience; alternatively, 4 or more years of directly applicable experience in semiconductor failure analysis, microscopy, materials characterization, or a related laboratory environment.
Hands-on experience operating Focused Ion Beam (FIB) or Dual-Beam FIB (DBFIB) systems.
Ability to interpret SEM, TEM, EDS, and FIB-generated data and communicate observations clearly.
Strong mechanical aptitude and manual dexterity for handling delicate samples and precision sample preparation.
Ability to work with sub-micron features and maintain high attention to detail when preparing and analyzing specimens.
Proficiency with Microsoft Office applications and technical report generation.
Ability to manage multiple investigations and prioritize work effectively.
Strong written and verbal communication skills.
Strong interpersonal skills and ability to collaborate with departmental and cross-functional teams.
Ability to perform the physical duties described, including precision handling and probing, close visual work, and lifting, carrying, or moving objects up to 25 pounds over short distances.
Ability and willingness to work in a Class 10,000 cleanroom, wear cleanroom attire and required PPE, and work with or around chemicals such as IPA and acetone.
Follow required EHS procedures and use appropriate safety equipment, including chemical, thermal, sharps, and other protective gear as required.

Nice To Haves

Experience preparing TEM lamellae using in-situ lift-out techniques.
Experience operating SEMs and performing EDS elemental analysis.
Experience operating or supporting TEMs.
Working knowledge of semiconductor device structures, thin-film materials, metallization systems, and failure mechanisms.
Experience with image processing and annotation software such as Photoshop, ImageJ, or equivalent.
Experience working in cleanroom, laboratory, or semiconductor manufacturing environments.

Responsibilities

Operate a Helios DBFIB system for precision cross-sectioning, defect localization, delayering, circuit-editing support, and structural characterization of semiconductor and photonic devices.
Prepare high-quality TEM lamella specimens using in-situ and ex-situ lift-out techniques, including thinning and final polishing for high-resolution TEM analysis.
Perform SEM imaging and EDS elemental analysis to characterize materials, contamination, defects, interfaces, and failure mechanisms.
Operate a TEM to evaluate device structures, material interfaces, process defects, contamination, and failure sites.
Analyze and document microscopy results in reports containing images, measurements, observations, and technical conclusions.
Support root-cause investigations through physical characterization of product, process, and reliability failures.
Perform sample preparation, including cleaving, polishing, mounting, and coating, for analytical investigations.
Assist Failure Analysis Engineers in developing analytical approaches and selecting characterization techniques for complex investigations.
Maintain laboratory equipment, fixtures, consumables, and documentation for safe and reliable operation.
Follow established procedures and identify opportunities to improve laboratory efficiency, sample preparation methods, and analytical workflows.
Train and assist other technicians and engineers on sample preparation methods, microscopy techniques, and laboratory best practices as assigned.
Support new product introductions, reliability studies, yield improvement initiatives, and customer-return investigations through advanced microscopy and materials characterization.
Attend scheduled safety training and follow site EHS procedures and corporate EHS standards, including use of required PPE.
Depending on location, execute and maintain applicable quality and environmental management system standards.