Failure Analysis and Reliability Engineer

Advanced Micro Devices, Inc•San Jose, CA

10d

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. We are looking for a Quality Engineer II to support component- and board-level failure analysis for advanced semiconductor products. In this role, you will perform electrical verification, fault isolation, physical failure analysis, board-level analysis, reliability stress support, and clear technical reporting. This is a hands-on engineering position suited for someone who enjoys solving complex technical problems, working across teams, and driving issues from initial investigation through root-cause conclusion. Job level will be aligned to the selected candidate’s experience. You will be part of a technical team focused on solving challenging semiconductor quality and reliability problems. This role offers the opportunity to build deep hands-on failure analysis expertise, work with advanced products and analytical tools, and contribute directly to product quality, reliability, and customer success.

Requirements

Bachelor’s degree in Electrical Engineering, Materials Science, or a related technical field.
1–3 years of experience in semiconductor failure analysis, product quality, reliability engineering, board-level analysis, or a related technical area.
Hands-on experience with electrical fault isolation and physical failure analysis methods.
Ability to analyze technical data, draw logical conclusions, and communicate results clearly in written reports.
Strong problem-solving skills, attention to detail, and ability to manage investigations with limited supervision.

Nice To Haves

Experience with dye-and-pry testing in accordance with IPC-TM-650 methods.
Experience with precision cross-sectioning, parallel lapping, chemical deprocessing, or related physical analysis techniques.
Familiarity with failure analysis tools and techniques such as curve tracing, C-SAM, X-ray, TDR, OBIRCH, thermal emission microscopy, and SEM.
Knowledge of semiconductor reliability stress testing, CMOS devices, circuit analysis, diagnostic techniques, IC fabrication, and assembly processes.
Ability to collaborate effectively with cross-functional engineering, quality, reliability, and product teams.

Responsibilities

Perform component- and board-level failure analysis to determine root cause of product or board failures.
Conduct electrical verification, fault isolation, and physical failure analysis using appropriate tools and techniques.
Perform board-level dye-and-pry analysis, PCB construction analysis, and physical failure analysis of PCB assemblies.
Support board-level reliability stress testing and bench testing before and after stress exposure when needed.
Document analysis results in clear, accurate failure analysis reports with evidence-based conclusions and recommended next steps.
Work with cross-functional engineering teams to investigate issues, communicate findings, and support corrective actions.