ID1 EUV Photolithography Senior Process Engineer

Micron TechnologyBoise, ID
Onsite

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise High-Volume Manufacturing (HVM) fab is at the leading edge of DRAM technology, driving sophisticated semiconductor innovation through EUV lithography. We operate in a fast-paced, data-driven manufacturing environment focused on achieving extraordinary yield, process capability, and operational excellence while maintaining strict safety and contamination-control standards. For this great opportunity as an EUV Photolithography Engineer, you will lead the development, optimization, and sustainment of EUV processes and scanner performance critical to advanced DRAM nodes. You will be responsible for ensuring process stability, improving yield and throughput, and driving continuous improvement through data analysis, multi-functional teamwork, and sophisticated process control techniques in a high-volume manufacturing environment.

Requirements

  • Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related field with 4+ years of semiconductor manufacturing experience, or Master’s degree with 2+ year of experience.
  • Proven experience in SPC, excursion management, and high-volume manufacturing process control.
  • Proven understanding of photolithography, including CD, overlay, defectivity, and process window control.
  • Strong analytical and problem-solving skills with experience in statistical analysis, DOE, regression, and root-cause methodologies.
  • Experience Applying AI or Employing AI-Enabled tools (e.g., LLMs or AI Assistants) for data analysis, automation, or engineering productivity improvements.

Nice To Haves

  • Direct experience with EUV lithography processes, scanner fleet management, and tool matching in HVM environments.
  • Familiarity with DRAM process integration and the impact of lithography on yield, cycle time, and cost.
  • Experience supporting new tool qualification, ramp to HVM, and technology node transitions.
  • Proven use of Generative AI, Agentic AI, or AI Supported analytics to improve process control, defect reduction, or operational efficiency.
  • Proven track record to lead multi-functional projects and influence key partners in a fast-paced manufacturing environment.

Responsibilities

  • Own EUV lithography processes and scanner fleets, ensuring stable high-volume manufacturing performance through SPC monitoring, overlay/CD optimization, defectivity reduction, and tool matching.
  • Lead rapid response to process excursions, including containment, root-cause analysis, wafer disposition, and implementation of corrective and preventive actions (CAPA).
  • Collaborate with Operations, Equipment Engineering, Integration, and Metrology teams to align on production priorities, resolve risks, and optimize cycle time, capacity, and output.
  • Drive continuous improvement of process capability, yield, and equipment productivity using sophisticated statistical methods, DOE, and data-driven decision-making.
  • Leverage AI-Enabled and AI Assisted solutions, including Large Language Models (LLMs), Generative AI, and Agentic AI tools, to enhance process optimization, automate analysis, and improve engineering productivity.

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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