Equipment Engineering Manager

Skywater•Kissimmee, FL

1d•Onsite

About The Position

SkyWater is searching for an Equipment Engineering Manager for our Advanced Packing site at Kissimmee, FL. If you are a self-motivated team player, who thrives in a fast-paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you! In this role, you will have the opportunity to lead a skilled team of Equipment Engineers who endeavor to manage, maintain, and improve equipment operations with pride, while setting and reinforcing a culture of safety! The selected candidate will have extensive collaboration with the area Equipment Engineering Team, Equipment Maintenance, Facilities Maintenance, and Process Engineering groups. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.

Requirements

Experience as a manager, supervisor, engineer, or technician in semiconductor or equivalent education and experience as follows: Associates degree with 10+ years’ experience or BS degree or higher with 8+ years’ experience
Demonstrated knowledge of preventive and corrective maintenance of semiconductor manufacturing equipment.
Outstanding communication skills, both written and verbal.
Demonstrated ability to meet commitments and deliver results, while being able to adapt to changing priorities.
Ability to manage, execute and track multiple projects simultaneously and shift priorities to meet business needs.
Experience with application and teaching of structured problem-solving methodology.
Encouraging to team and staff; able to mentor and lead.
Accurate and precise attention to detail in performance of role.
Physically able to perform the role with or without accommodation, which may include standing, bending, squatting, and lifting.
Knowledge and proficiency in computer use and Microsoft Office Suite products.
Knowledge of Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, Wet Chemistry Distribution and delivery systems.
Demonstrated ability to meet requirements and deliver results.
Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.
Experience Creating and Managing Preventive maintenance programs.
Experience with set up and use of Maintenance management software systems.
High level of understanding of equipment component behavior.
Experience Integrating Equipment Maintenance Management Software.
US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

Nice To Haves

Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Dicing/Grinding/Singulation, Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).
Experience with Fan Out Wafer Level Packaging Equipment.
Experience with automated fault detection and control systems (FDC) is preferred.
Demonstrated knowledge of equipment KPIs such as Availability, MTBF, MTTR, etc.
Demonstrated at least basic level understanding of Statistical Process Control (SPC)

Responsibilities

Manage Equipment Engineers in the FAB for all tool types and disciplines.
Participate in management of all new equipment installations and modifications. Including initial documentation and PM creation.
Serve as a key player in planning to support continuous growth and efficient equipment operation.
Manage vendor contracts to achieve results, when needed.
Promote and maintain a safe work environment for all employees.
Ensure all processes and systems are compliant with regulations.
Manage, develop, and mentor equipment engineers.
Build and improve systems to ensure all manufacturing equipment is safe to operate and manufactures quality product.
Participate with resolving unplanned down events and driving permanent Root Cause Corrective Actions, using Lean processes, procedures, and problem-solving tools.
Make daily resource allocation decisions, balancing competing priorities, to serve the needs of the Process, Equipment, and Manufacturing teams.
Drive cost reduction efforts to help achieve cost management and savings goals.
Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Advanced Packaging processes including Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding.
Work with process engineering and equipment maintenance teams to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
Participate in cross-functional teams that create efficiencies across all layers of the organization.