Equipment Engineering

Analog Devices•Wilmington, MA

3d•Onsite

About The Position

Join Analog Devices (ADI) and contribute to a culture of innovation and impact. For over 55 years, ADI has been developing breakthrough technologies that improve lives. You will collaborate with bright minds to solve complex problems in areas like autonomous vehicles, drones, factories, augmented reality, and remote healthcare. ADI is committed to its employees through beneficial programs, aligned goals, continuous learning, and sustainable practices. Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader enabling breakthroughs at the Intelligent Edge by bridging the physical and digital worlds. ADI integrates analog, digital, AI, and software technologies into solutions for climate change, reliable connectivity, automation, robotics, mobility, healthcare, energy, and data centers. With over $11 billion in revenue in FY25, ADI empowers innovators to stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. This role is part of ADI’s MEMS fabrication team, responsible for ensuring critical manufacturing equipment in Photo, Wafer Bond, and Etch areas operates safely, reliably, and at peak performance. Responsibilities include executing preventive maintenance, troubleshooting issues to root cause, collaborating with Process Engineering and Operations, and driving continuous improvement projects to enhance tool uptime, yield, and throughput.

Requirements

Bachelor’s in Electrical , Mechanical, Chemical Engineering, Materials Science, Physics or related field; or Associate’s + 1–2 years’ relevant semiconductor/cleanroom experience.
Hands‑on aptitude with tools, test equipment (DMMs, oscilloscopes, leak detectors), and reading schematics/mechanical drawings.
Fundamental knowledge of cleanroom practices and equipment maintenance basics (vacuum systems, gas delivery, motion control).
Strong problem‑solving, attention to detail, and communication skills; ability to document procedures and results clearly.

Nice To Haves

Exposure to photolithography, wafer bonding, or etch tools (internships, co‑ops, or coursework).
Experience with PM execution, RCFA/5‑Why, SPC basics, and collaborating with vendors/field service.
Familiarity with CMMS/work order systems and updating PM checklists/BKMs.

Responsibilities

Perform scheduled PMs, calibrations, and health checks; respond to tool downs and restore to production safely and quickly.
Diagnose mechanical, electrical, vacuum, pneumatics, and software/ controls issues; document findings and implement corrective actions (5‑Why , RCFA ).
Support coaters/developers, aligners/steppers, and metrology associated with lithography; partner with ops to optimize recipes and reduce constraints/wait time.
Support wafer bonding equipment (e.g., thermal/adhesive/Anodic bonding tools); maintain tool safety interlocks, fixtures, and process hardware.
Support dry/wet etchers (e.g., plasma/RIE/ICP and cleans); monitor error rates and chamber health, update PM specs and checklists.
Update maintenance procedures, PM checklists, BKMs and specifications; keep CMMS/Work Orders current with accurate parts usage and notes.
Analyze repeat faults/trouble list data, lead small DI projects, and present action plans to the area team.
Follow cleanroom protocols and EHS procedures including Lockout/Tagout (LOTO) and hazardous materials handling; keep work area organized and safe during/after maintenance.
Work closely with Process Engineering, Operations, Facilities, and vendor field service to schedule activities and minimize production impact.