The Advanced Electronics and Photonics (AEP) Core Facility seeks a qualified candidate for an equipment engineering position. The candidate will mainly be focused on repair and augmentation of wet processing equipment including electroplating, photolithography, wet chemical etching, lamination, and panelization equipment. Primary areas of responsibility will include installation support, repairs, and maintenance on our f300mm wafer packaging toolsets as well as existing equipment in the AEP Core. Scope of maintenance needs may increase beyond wet etching equipment to including vacuum processing and metrology equipment as needed. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, photolithography, packaging, and electrical test to ensure robust wafer packaging processes that meet the precise physical and electrical requirements for our customers. As part of the AEP Core operations team, you will help to maintain the wafer prep and finishing process areas by supporting operations and increasing equipment up time, responding to production equipment issues, implementing solutions, reducing costs, and improving equipment uptimes. In this position, you will support existing equipment, assist in installing new equipment, and identify potential equipment improvements. Customer service is an integral part of the maintenance engineer position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must. This position is funded by DoD and requires candidates to meet the definition of US person as defined in as defined by 22 C.F.R. § 120.62 and 15 C.F.R. § 772.1.
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Job Type
Full-time
Career Level
Mid Level