ATD MIHL Equipment Development Engineer

Intel•Chandler, AZ

6d•$115,110 - $188,890•Onsite

About The Position

Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry. Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.

Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
Competency in mechanical design software such as SolidWorks or AutoCAD.

Nice To Haves

Proven ability to lead technical innovation and manage complex, time-sensitive projects.
Understanding of semiconductor fabrication processes and packaging technologies.
Familiarity with supply chain management in a manufacturing or materials qualification environment.
Experience with high-precision manufacturing methods, including stamping and CNC machining.

Responsibilities

Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
Lead problem-solving initiatives and drive continuous improvement in equipment and processes.
Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.