Engineer I - Failure Analysis

Microchip Technology Inc. • Chandler, AZ

5d • Onsite

About The Position

Seeking an individual to work in our Failure Analysis team in Chandler, Arizona. This role is focused on physical characterization, microscopy, and device structure analysis of semiconductor devices and packages. This position emphasizes hands-on laboratory analysis to understand how semiconductor devices are physically constructed and differentiated—including materials, layouts, device structures, and packaging technologies.

Requirements

• Bachelor's or Graduate level degree in Materials Science, Metallurgical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related technical field
• 0-3 years of professional experience
• Ability to work both independently and with guidance to collect and document data
• Strong communication, organization, and technical documentation skills
• Willingness and ability to learn FA techniques, tools, and workflows

Nice To Haves

• Any experience in will be considered
• Careful observer with the ability to document and compare fine physical details
• Comfortable working with small geometries, fine features, and detailed imagery
• Intellectual curiosity about how physical implementation connects to electrical function and design intent
• Organized, methodical approach to lab work and data documentation

Responsibilities

• Perform physical and structural analysis of semiconductor devices and packages within the FA lab
• Sample Prep using standard FA and metallurgical techniques, including: Mechanical grinding and polishing, Cross-sectioning and delayering, Etching, staining, and contrast enhancement
• Use laboratory characterization tools to analyze device structures, including: Optical microscopy, Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) / elemental analysis
• Support die-level and package-level teardowns, documentation, and image capture
• Conduct layer-by-layer analysis and assist with layout reconstruction based on physical observations
• Document and catalog device features such as: Metallization stacks and interconnect schemes, Transistor and device structures, Materials systems and interfaces, Packaging and assembly approaches
• Collaborate with senior FA engineers to correlate physical observations with: Electrical behavior, Device physics concepts, Layout and design intent
• Prepare clear technical summaries highlighting: Tools and techniques used, Observed device structures and technology characteristics

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level