Failure Analysis Engineer

Allegro MicroSystems • Manchester, NH

9h • Onsite

About The Position

The Failure Analysis Engineer position is a highly hands-on role dedicated to performing in-depth analysis of semiconductor integrated circuits (ICs) failures. This position is primarily based in the Failure Analysis lab, with the majority of the work involving direct lab activity. The role focuses on identifying root causes for yield excursions, new technology development issues, and reliability failures. The successful candidate will utilize precision electrical characterization tools and physical analysis techniques to determine failure mechanism and assist in root cause analysis.

Requirements

• Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering is required.
• Understanding of semiconductor device physics, IC fabrication processes, and packaging technologies.
• Excellent problem-solving skills and a methodical approach to root cause analysis.
• Ability to interpret complex electrical schematics and layouts.
• Strong written and verbal communication skills, with the ability to present technical information effectively.
• Ability to work independently and as part of a team in a fast-paced environment.

Nice To Haves

• Familiarity with statistical analysis tools and methodologies for data interpretation.
• Experience with programming or scripting for automation of analysis tasks.
• Knowledge of reliability testing standards (e.g., AEC-Q100, JEDEC) and failure analysis techniques and equipment is a plus.
• Experience with Allegro's specific product lines (e.g., magnetic sensors, power management ICs, motor drivers) is a plus.

Responsibilities

• Perform extensive manual probing and electrical fault isolation on wafers and packaged parts.
• Utilize Source Measure Units (SMUs), oscilloscopes, and curve tracers to characterize electrical signatures and pinpoint anomalies.
• Perform targeted physical deconstruction, including mechanical polishing/grinding for cross-sections and the use of wet chemical etching and decapsulation to correlate electrical findings with physical defects.
• Advance FA techniques: Utilize advanced failure analysis techniques such as optical microscopy, SEM/EDX, FIB, OBIRCH, PEM and IR microscopy.
• Conduct in-depth analysis on wafer-level issues to identify process-related yield issues.
• Work closely with the technology development team to analyze failures in next-generation silicon processes.
• Analyze devices that have failed during stress testing (REL) to understand degradation mechanisms and long-term stability.
• Document findings in detailed technical reports and collaborate with Process, Design, and Yield Enhancement (DYE) teams to drive corrective actions.

Benefits

• We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.
• Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.
• You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.
• At Allegro, we are committed to providing a harassment-free environment of mutual respect to fuel innovation through inclusive thought collaboration.
• Allegro is an Equal Opportunity Employer and does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, physical or mental disability, national origin, veteran status, parental status, or any other basis covered by appropriate law.
• Allegro makes hiring decisions based solely on qualifications, merit, and business needs at the time.
• Eligible applicants must reside in a state where Allegro currently has an office location: This includes New Hampshire, Massachusetts, Texas, and Michigan.
• Certain positions (such as field sales roles) may be exempt from this requirement.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level