Engineer- HIG HBM, DTPCO

MicronBoise, ID

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the High Bandwidth Memory (HBM) organization, this role focuses on advancing Design Technology Pathfinding and Co-Optimization (DTPCO) initiatives by developing a deep understanding of HBM cube behavior and limitations. The team works across design, modeling, and silicon validation to enable improved yield, reliability, and scalability of next-generation memory products. In this role, the engineer supports bench-level testing, system analysis, and modeling activities to validate design hypotheses and improve HBM performance. The position involves working with silicon data, performing experiments, and collaborating across engineering teams to ensure robust system integration and product readiness.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering or related field
  • Understanding of electrical, thermal, and mechanical behavior in semiconductor systems
  • Experience or exposure to lab-based testing, data analysis, and debugging methodologies
  • Ability to analyze system performance, identify issues, and contribute to corrective action planning

Nice To Haves

  • Exposure to memory systems or High Bandwidth Memory (HBM) architectures
  • Familiarity with silicon validation techniques such as parametric testing, timing analysis, or failure analysis
  • Experience working with multi-physics testing environments (thermal, stress, electrical)
  • Knowledge of system-level modeling or simulation concepts
  • Strong communication skills and ability to present findings to multi-functional teams

Responsibilities

  • Plan and execute bench-level HBM cube tests involving thermal, mechanical, and electrical conditions, including steady-state and transient analysis
  • Analyze silicon data to validate hypotheses, support modeling efforts, and aid in yield and performance improvement
  • Evaluate system behavior including power/thermal correlation, warpage, stress response, IDD, timing margins, parametric data, and failure signatures
  • Support development of system requirements, specifications, and input/output processes to ensure hardware and software compatibility
  • Collaborate with cross-functional teams to identify issues, resolve deficiencies, and recommend corrective actions for system-level integration

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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