Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the High Bandwidth Memory (HBM) organization, this role focuses on advancing Design Technology Pathfinding and Co-Optimization (DTPCO) initiatives by developing a deep understanding of HBM cube behavior and limitations. The team works across design, modeling, and silicon validation to enable improved yield, reliability, and scalability of next-generation memory products. In this role, the engineer supports bench-level testing, system analysis, and modeling activities to validate design hypotheses and improve HBM performance. The position involves working with silicon data, performing experiments, and collaborating across engineering teams to ensure robust system integration and product readiness.
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Job Type
Full-time
Career Level
Entry Level