Engineer Electrical 3

HII's Mission Technologies division • Syracuse, NY

2d • $90,486 - $145,000

About The Position

This opportunity resides with Warfare Systems (WS), a business group within HII’s Mission Technologies division. Warfare Systems comprises cyber and mission IT; electronic warfare; and C5ISR systems. HII works within our nation’s intelligence and cyber operations communities to defend our interests in cyberspace and anticipate emerging threats. Our capabilities in cybersecurity, network architecture, reverse engineering, software and hardware development uniquely enable us to support sensitive missions for the U.S. military and federal agency partners. Huntington Ingalls Industries – Mission Technologies division is seeking a highly skilled and motivated CCA Board Design Engineer 3 to join our growing engineering team. In this role, you will be responsible for the PCB design and layout of complex, high-reliability Circuit Card Assemblies (CCAs) and Printed Circuit Boards (PCBs) utilized in cutting-edge defense, national security, and electronic warfare systems. As a Level 3 engineer, you will act as a technical lead on complex design tasks, collaborating closely with systems, mechanical, thermal, and software engineers to deliver robust hardware solutions from conceptual design through production.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field with a minimum of 5 years of relevant experience; OR a Master’s degree with 3 years of relevant experience.
• Demonstrated expert-level experience with industry-standard PCB design suites (e.g., Altium Designer, Siemens EDA/Mentor Graphics Xpedition, or Cadence Allegro).
• Strong background in designing multi-layer boards utilizing high-density interconnect (HDI) microvias, controlled impedance, and fine-pitch BGA components.
• Proven experience selecting components and designing circuits featuring FPGAs, processors, high-speed memory interfaces, and power management units (PMUs).

Nice To Haves

• Active Secret clearance.
• Familiarity with aerospace/defense standards such as MIL-STD-810, IPC-2221/2222, and IPC-A-610.
• Experience with RF/Microwave board layout and isolation techniques.
• Familiarity with Altium Designer and Altium component and project databases
• Experience utilizing simulation tools like HyperLynx, Ansys HFSS, or Keysight ADS for Signal Integrity and Power Integrity analysis.
• Strong written and verbal communication skills, with the ability to present technical design reviews (PDR/CDR) to internal management and external clients.

Responsibilities

• Lead layout design of complex multi-layer, high-speed digital, analog, and mixed-signal CCAs, as well as assist in schematic capture and documentation.
• Guide junior engineers and design layout specialists through complex routing challenges, high-speed signaling constraints, and power distribution network (PDN) design.
• Apply Design for Manufacturing (DFM), Design for Testing (DFT), and Design for Assembly (DFA) principles to ensure seamless transition from design to full-scale production.
• Partner with Mechanical and Thermal Engineers to ensure proper physical integration, structural integrity, and thermal dissipation of the CCAs within rugged environments.
• Generate comprehensive engineering documentation packages, including schematics, bills of materials (BOMs), fabrication drawings, and assembly instructions.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level