Entry-Level, Associate, or Mid-Level Electronics Design and Analysis Engineer (Electronic Packaging Design)

Boeing•El Segundo, CA

2d•$79,050 - $162,150•Onsite

About The Position

Boeing Space, Intelligence & Weapons Systems is currently hiring an Entry-Level, Associate, or Mid-Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join us as part of our Electronics Packaging and Product Design Team located in El Segundo, CA. We are seeking exceptional Mechanical Engineers with a passion for innovation to join our team and become part of something truly remarkable. As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us. We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis. You will be at the forefront of satellite missions, unlocking new frontiers in space exploration. In addition, you will have the opportunity to work on projects involving multichip modules, microelectronics, electronic systems, and much more. The breadth of our work while working alongside world-class engineers and mentors, will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure. To further enhance your experience, our on-site satellite factory is at your disposal, enabling you to unleash your creativity and expertise while delivering solutions at the highest level of excellence. This proximity allows for seamless collaboration with satellite engineers, giving you firsthand knowledge of the intricacies and complexities of satellite missions. By working closely with experts in the field, you will contribute to the seamless integration of our electronics packaging solutions, ensuring they meet the rigorous demands of the space environment. Develop your technical competence as well as your leadership skills at a company with huge potential for long-term career growth. We’re highly supportive of innovative thinking, we respect and acknowledge hard work, we recognize maturity and integrity, and we reward bottom-line achievement.

Requirements

Ability to obtain a US Security Clearance for which the US Government requires US Citizenship as a condition of employment. A final U.S. Secret Clearance Post-Start is required.
Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
Experience using Computer-Aided Design (CAD) tools
Either: Experience with thermal, structural, dynamics, and/or vibration analysis and tools -OR- Experience with Printed Circuit Boards (PCB) design or assembly
Must meet U.S. export control compliance requirements. To meet U.S. export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.62 is required. “U.S. Person” includes U.S. Citizen, U.S. National, lawful permanent resident, refugee, or asylee.

Nice To Haves

An active Top Secret /SCI clearance
Experience within aerospace or related industry or with space electronics
Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers
Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
Experience leading teams on complex projects
Level 1: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), computer science, engineering data science, mathematics, physics, or chemistry (e.g. Bachelor), or an equivalent combination of technical education and experience
Level 2: 2 or more years' related work experience or an equivalent combination of technical education and experience
Level 3: 5 or more years' related work experience or an equivalent combination of technical education and experience

Responsibilities

Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements.
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements.
Performs detailed structural and thermal analysis using hand calculations and analysis tools.
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level.
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs).
Validates designs through various methods of review, testing and analysis.
Develops, deploys and supports new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements.
Conducts Root Cause and Corrective Action to investigate failures and go-forward plans.
Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements.
Supports Supplier Management with make/buy recommendations and other technical services of limited scope.
Investigates emerging technologies to develop concepts for future product designs to meet projected requirements.
Works under general direction.