[US] Electronic Engineer

EdgeCortix • Leesburg, VA

7h • Remote

About The Position

EdgeCortix is seeking a talented and experienced Electronic Engineer to lead the design and development of board-level hardware products, including PCBAs and reference designs featuring its proprietary AI Accelerator chips. The role focuses on next-generation, high-speed PCIe-based hardware products and ownership of the hardware development lifecycle, from architecture and schematic design through PCB layout supervision, signal integrity analysis, lab bring-up, validation, and production transition. The engineer will collaborate with firmware, software, mechanical, and other teams to deliver robust, high-performance electronic products.

The position is U.S.-based, with remote work permitted. East Coast time zone candidates are preferred, and Washington, DC/DMV-area candidates are a plus. The role also involves preparing reference-design materials and supporting the Marketing team in creating polished, customer-ready documentation to encourage customer adoption and design-in activity.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
• At least 5 years of experience designing complex, high-density, multilayer (12+ layer) PCBs implementing high-speed protocols such as 25G/56G/112G Ethernet, DDR4/DDR5, or PCIe Gen 3+.
• High proficiency with schematic capture and PCB layout tools such as Cadence OrCAD/Allegro or Altium Designer.
• Hands-on experience, directly or indirectly, with SI/PI simulation software such as Ansys HFSS/SIwave or Cadence Sigrity.
• Strong debugging and troubleshooting skills, with proficiency using high-speed digital test equipment.
• Deep understanding of high-speed data transmission and power electronics design, including multiphase buck converters and PMICs for high-power accelerators.
• Experience with and appreciation of PCB fabrication, SMT assembly, and PCBA thermal management.

Nice To Haves

• Direct PCIe board-development experience, at least Gen 3/4; Gen 5/6 experience is a plus.
• East Coast time zone location; Washington, DC/DMV-area candidates are a plus.

Responsibilities

• Specify hardware requirements, select components, capture schematics, and manage bills of materials.
• Lead the design and schematic capture of complex multilayer digital boards featuring power delivery networks, high-speed SerDes and PCIe interfaces, BMCs, AI accelerators, FPGAs, CPUs, and high-speed memory.
• Analyze and optimize signal and power integrity, independently or in collaboration with simulation engineers, including data transmission characteristics and power delivery network performance.
• Guide PCB layout designers and thermal mechanical engineers on material and stack-up selection, high-speed routing and power delivery constraints, component placement, and thermal management.
• Define and lead hands-on board bring-up, debugging, characterization, and laboratory validation.
• Collaborate with firmware and driver teams to support AI acceleration workloads and integration into deployable systems.
• Design for and support regulatory compliance testing, including EMI/EMC, safety, protocol compliance, interoperability, and environmental reliability validation.
• Create reference-design guides, schematic documentation, layout notes, block diagrams, operational concepts, and validation procedures.
• Support the Marketing team in packaging reference-design materials into polished, customer-ready documentation and solutions.

Benefits

• Competitive salary, benefits, and equity participation.
• Flexible work environment.
• Remote-work options.
• Opportunity to shape the category narrative for next-generation AI infrastructure.
• Opportunity to work at the forefront of generative and agentic AI at the edge.
• Opportunity to work alongside a global team across engineering, research, product, and business.
• Critical role in scaling a high-growth deep-technology company.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior