The Electromechanical Packaging Engineer will be working with a Lead Engineer and be responsible for supporting chip scale packaging design and HDI organic substrate layout for the integrated voltage regulator product line. This role involves collaborating with substrate layout, ASIC design, and manufacturing engineers. The engineer will also create mechanical drawings for substrate fabrication and packaged part assembly, and work with vendors for components, assembly, and test.
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Job Type
Full-time
Career Level
Mid Level