ElectroMechanical Packaging Engineer III

Lockheed Martin•Littleton, CO

2d•Onsite

About The Position

Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis. This position does not support teleworking; the selected candidate will be located near our Lockheed Martin Space facility in Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time. Key activities you will accomplish in this role: Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design. Create 3D solid models in CREO of space flight avionics and power hardware. Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations. Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment. Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.

Requirements

Experience with the full product life cycle.
Knowledge of the definition, interpretation, and implementation of design requirements.
Coordination and execution of hardware designs.
Development and integration of hardware for both custom and procured electronic assemblies in accordance with all Lockheed Martin Space engineering process specifications.
Supported technical design review preparation.
3+ years of professional experience.
Bachelor of Science or higher from an accredited college in Mechanical Engineering or related discipline, or equivalent experience/combined education.
Experience in electro-mechanical packaging/enclosure design.
Working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
Ability to obtain and maintain a DoD Secret clearance; thus a US Citizen.

Nice To Haves

Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with 3D printing/prototyping.
Experience with CREO CAD modeling and Zuken
Missile/Aerospace related experience.
Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
Ability to communicate issues and additional resource needs to leadership.
Experience with subcontracted hardware suppliers.
Experience performing tolerance stack-ups.
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.).
Hands-on hardware experience.
Active security clearance.

Responsibilities

Electronics packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro-E CAD design.
Create 3D solid models in CREO of space flight avionics and power hardware.
Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.