About The Position

The Electromechanical Integration Engineer designs and integrates mechanical packaging, interconnect architecture, and structures for avionics, power systems, and electro-optical payloads used on Group 5 aircraft and high-speed missiles. The role supports the full development lifecycle, from concept through qualification and flight operations, with a focus on rugged, high-performance systems optimized for Size, Weight, Power, and Cost (SWaP-C). The engineer designs flight-critical enclosures, chassis, and mechanical packaging for circuit card assemblies, batteries, electro-optical payloads, and cable and harness assemblies. Working closely with electrical engineers and other cross-functional teams, the engineer develops detailed models and drawings, verifies designs through analysis and testing, addresses anomalies, and supports design reviews and execution of engineering deliverables.

Requirements

  • B.S. or higher in Mechanical Engineering, Mechatronics, Aerospace Engineering, or equivalent experience.
  • At least 4 years of experience in electronics packaging and/or electromechanical systems design in aerospace, defense, automotive, or robotics.
  • Direct experience designing hardware to MIL-STD-810 and MIL-STD-464/461 environmental and EMI/EMC standards.
  • Proficiency with 3D CAD such as Siemens NX, SolidWorks, CATIA, or similar for complex surface modeling, enclosure packaging, and harness routing.
  • Understanding of advanced manufacturing processes, including CNC machining, sheet metal fabrication, casting, injection molding, and 3D printing, with hands-on prototyping experience.
  • Strong communication, collaboration, and teamwork skills across multi-site, multidisciplinary teams.
  • Eligibility to obtain and maintain an active U.S. Secret security clearance.

Nice To Haves

  • Extensive experience with Siemens NX and Teamcenter.
  • Familiarity with eCAD tools such as Altium and Cadence Allegro, and harness design software such as Siemens Capital and Zuken E3.
  • Practical understanding of bare-board PCB manufacturing, high-density interconnect (HDI) stackups, and SMT assembly standards (IPC-A-610/J-STD-001).
  • Advanced FEA and thermal simulation experience with tools such as Ansys Mechanical, Ansys Icepak, FloTHERM, or Ansys Sherlock.
  • Experience designing battery modules or packs, or precision-aligned electro-optical or sensor payloads.
  • Active Top Secret DoD clearance.

Responsibilities

  • Design flight-critical enclosures, chassis, and mechanical packaging for high-density circuit card assemblies, battery systems, electro-optical payloads, and cable and harness assemblies.
  • Collaborate with electrical engineers on PCBA layout, connector configurations, keep-out zones, harness routing, and thermal and grounding interfaces.
  • Create detailed 3D models and drawing packages, including GD&T and tolerance stack-up analyses, to optimize designs for assembly, serviceability, and high-yield manufacturing.
  • Conduct hand calculations and structural FEA, collaborating with thermal and fatigue analysts to validate performance before physical hardware is committed.
  • Design hardware to withstand aerospace vibration, shock, thermal extremes, moisture, and EMI/EMC requirements, including applicable MIL-STD-810, MIL-STD-464/461, and DO-160 standards.
  • Lead root-cause investigations and corrective actions for mechanical, environmental, or manufacturing anomalies identified during qualification or flight operations.
  • Support PDR and CDR design reviews and drive engineering deliverables across distributed, cross-functional teams, including systems, hardware, software, manufacturing, test, and supply chain.

Benefits

  • Highly competitive equity grants are included in the majority of full-time offers and are considered part of total compensation.
  • Top-tier benefits for full-time employees, with a comprehensive, competitive benefits package available at little to no cost to employees.
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