Electromechanical Engineer Level 2 - Electronics Packaging - Linthicum
About The Position
Northrop Grumman Space Systems is seeking an early-career Electromechanical Engineer Level 2 to work in Linthicum, Maryland, within the Intelligence Systems Business Unit. The engineer will support the development, design, fabrication, integration, and testing of space sensor payload hardware for satellite programs, including RF, electro-optical, digital, and power designs. Hardware may include antennas, electro-optical sensors, and supporting electronics chassis assemblies such as processors and receivers. The role spans the hardware lifecycle, from concept and detailed design through CAD modeling, documentation release, fabrication, integration, factory support, and testing. The engineer will work with mechanical, electrical, and systems engineers to deliver innovative, cost-effective hardware while supporting program cost, schedule, and technical performance objectives. The position involves presenting technical data at milestone reviews, developing methods and procedures for testing hardware against requirements, and troubleshooting integration and test issues. Travel is 10% of the time. Relocation assistance may be available. No clearance is required to start, but the employee must be able to obtain and maintain a Top Secret clearance.
Requirements
- Bachelor’s degree in a STEM field and 2 years of engineering experience, or a Master’s degree in STEM.
- Proficiency in mechanical hardware design for RF/EO sensor or antenna assemblies, including electromechanical subsystems and electronic packaging.
- Expert-level use of 3D CAD tools such as Creo or Siemens NX.
- Ability to work independently without appreciable direction and set and meet technical goals aligned with program objectives.
- Ability to develop clear and concise documentation and review materials.
- Must be able to obtain and maintain a Top Secret clearance.
Nice To Haves
- Experience with electronics packaging and design, including Printed Wiring Board (PWB) and Circuit Card Assembly (CCA) design and oversight.
- Ability to collaborate with multidisciplinary teams.
- Ability to work in a fast-paced environment with multiple projects being developed and deployed simultaneously.
- Excellent communication and interpersonal skills, including the ability to interface with employees and management at all levels.
- Active, in-scope DoD Top Secret or SCI clearance.
Responsibilities
- Support mechanical design, analysis, integration, and testing for RF, EO, digital, and power hardware supporting satellite programs.
- Support development, design, fabrication, and testing of space sensor hardware across multiple program efforts.
- Perform hardware development throughout the design lifecycle, including concept and detailed design, CAD modeling, documentation release, fabrication, integration, factory support, and testing.
- Understand mechanical requirements and technical performance of space program hardware and subsystems to help achieve cost, schedule, and technical performance objectives.
- Present technical solutions and data at milestone reviews.
- Research and develop procedures, methods, and tools to test space hardware conformance to documented and derived system requirements.
- Read and interpret schematics, block diagrams, sketches, instructions, and manufacturer specifications and operation manuals; analyze hardware configurations.
- Work independently and collaborate with engineers, management, contractors, and cross-functional teams.
- Troubleshoot hardware issues and nonconformances during integration and testing, and suggest improvements and optimization.
Benefits
- Health insurance coverage
- Life insurance
- Disability insurance
- Savings plan
- Company-paid holidays
- Paid time off (PTO) for vacation and/or personal business
- Employees may be eligible for overtime, shift differential, and a discretionary bonus
- Relocation assistance may be available
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
