Mechanical Engineer, Electronics Packaging

Karman Industries•Los Angeles, CA

2d•$80,000 - $225,000

About The Position

Karman Industries is seeking a highly motivated electronics packaging expert to join our team designing the next generation of heat processing systems. The candidate will lead the design, development, and qualification of packaging systems for power conversion devices, high-frequency transformers, medium voltage electrical machines, and cutting-edge medium voltage electronics to enable the Karman Heat Processing Unit (HPU) and subsequent product development. The role will include system level design with a view to manufacturing, addressing mounting, isolation, durability, heat transfer, and more. We are a team that relies on strong first principles approach, working together to deliver a cohesively developed system.

Requirements

B.Sc. in mechanical engineering
3+ years of experience in the design of packaging for electrical hardware
Hands-on experience with enclosures and electrical connectors
Knowledge of basic DFM practices
Self-motivated / high performer, ability to self-manage, multi-task, and communicate excellently

Nice To Haves

Background in electrical isolation and safety, including electrical safety standards in the UL or IEC family
Experience developing cooling systems
Competency with structural and thermal analysis techniques
Familiarity with industrial automation and the vendor ecosystem

Responsibilities

Define electronics packaging strategies for power electronics systems, including inverters, drive systems, power supplies, and controls
Design mounting and isolation systems for PCBs and electrical assemblies
Collaborate with manufacturing engineers to identify viable fabrication methods for packaging and enclosures
Coordinate with thermal analysis experts to identify thermal and thermo-mechanical factors in lifespan of subcomponents
Work with a tightly knit team across disciplines to integrate thermal, mechanical, and electrical designs into cohesive power conversion products
Ability to implement novel solutions to challenging problems, thinking outside the box and challenging the status quo
Develop analytical, physics-based (first principles) models to determine hardware performance and limitations