Electromechanical Design Engineer
About The Position
Northrop Grumman Mission Systems is seeking an Electromechanical Design Engineer to join their team. This position will be located in Linthicum, Maryland and will require 100% on-site work. The role involves designing, prototyping, and providing production support for state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies. The engineer will collaborate within a cross-functional Integrated Product Team (IPT), communicating effectively with peers in electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing. Responsibilities also include organizing and prioritizing tasks to meet project milestones within schedule and budget, and providing technical leadership and mentoring to less experienced personnel. This position is contingent upon contract award and the ability to obtain an active DoD Secret Clearance or the successful transfer of an active DoD Secret Clearance prior to start.
Requirements
- Bachelor’s degree with 2 years of experience, a master’s degree with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
- U.S Citizenship is required.
- The ability to obtain/maintain a DoD Active Secret clearance.
- Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate\PWB layout
- Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
- Proficient with AutoCAD and/or Xpedition software
- Familiarity with NX or other 3D modeling software
Nice To Haves
- Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
- A current/active DoD Secret Clearance or higher
- Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
- Familiarity with thermal and structural analysis considerations, methodologies, and software tools
- Experience with hands-on assembly and testing of prototype electronic hardware
- Experience in a technical leadership role on a cross-functional product development team
- Experience routing RF signals
Responsibilities
- Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
- Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
- Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
- Providing technical leadership and mentoring to less experienced personnel.
Benefits
- Relocation assistance may be available
- Health Plan
- Savings Plan
- Paid Time Off
- Education Assistance
- Training and Development
- 9/80 Work Schedule (where available)
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
