Electrical Engineer: RF Subsystems

HRL Laboratories•Calabasas, CA

13h

About The Position

HRL Laboratories pioneers the next frontiers of physical and information science, delivering transformative technologies in automotive, aerospace, and defense. HRL advances critical missions for its customers to help them remove limitations and create competitive advantage. For over 70 years, HRL's rich portfolio of scientific discoveries and engineering innovations continues to build on each other. As a private company owned jointly by Boeing and GM, HRL prioritizes purpose over profit, significantly advancing the state of the art. HRL Laboratories develops radiofrequency, millimeter-wave and electro-optical sensors using state-of-the-art materials and device fabrication processes to deliver agile, mission-ready systems. Our high-performance solutions are highly integrated, architecturally low cost, and optimized for size, weight, and power efficiency while leveraging commercial, custom, and novel mixed-signal innovations. This role contributes technical expertise and works within a fast-paced team of scientists and engineers on the development of next-generation RF/mmWave Subsystems. The candidate will be expected to work within diverse teams, taking responsibility for the design, implementation, and test of high-performance electrical subsystems.

Requirements

Bachelor’s Degree, or equivalent
Experience with Schematic Capture is required.
Experience with PCB Layout is required.
At least 3 years of experience designing, implementing, and testing electronics circuits required.
Experience simulating the behavior of electronics in Spice, ADS, or similar software is required.
U.S. Citizenship with the ability to obtain and maintain a US Government security clearance desired.

Nice To Haves

Experience with RF & mmW PCB development, layout, and testing is a plus.
Experience with Altium Designer is preferred.
Experience with design and qualification of hardware for military applications
Working knowledge of electronic sub-assemblies from the component to subsystem level, including operation, controls, safety, etc.
A working familiarity with characteristics and tradeoffs of today’s active and passive components and a working knowledge of the availability of COTS components.
Understanding of RF components and devices.
Knowledge of conventional and advanced microelectronic packaging/integration and thermal mgmt.
Familiarity with digital, mixed-signal, power and signal integrity tools are desired.
Familiarity with PCB manufacturing, also standards (IPC 6012, IPC-A-610, Drill tolerancing, etc)
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
Ability to work well in a team and independently.

Responsibilities

Perform preliminary and critical designs based on COTS or custom active and passive parts and components with oversight from a Senior Engineer.
Perform or oversee fabrication and testing with oversight from a Senior Engineer.
Schematic Capture, PCB layout, fabrication documentation and module assembly.
Work with Mechanical Engineering to develop thermal solutions and any mechanical design considerations.