Electrical Engineer: RF Subsystems

HRL Laboratories•Calabasas, CA

About The Position

HRL Laboratories pioneers the next frontiers of physical and information science, delivering transformative technologies in automotive, aerospace and defense. As a private company owned jointly by Boeing and GM, HRL prioritizes purpose over profit, significantly advancing the state of the art and transitioning work back to customers for real-world application. HRL Laboratories develops radiofrequency, millimeter-wave and electro-optical sensors using state-of-the-art materials and device fabrication processes to deliver agile, mission-ready systems. These high-performance solutions are highly integrated, architecturally low cost, and optimized for size, weight and power efficiency while leveraging commercial, custom and novel mixed-signal innovations. The Electrical Engineer will contribute technical expertise and work within a fast-paced team of scientists and engineers on the development of next generation RF/mmWave Subsystems, taking responsibility for the design, implementation and test of high-performance electrical subsystems.

Requirements

Bachelor’s Degree, or equivalent
Experience with Schematic Capture is required.
Experience with PCB Layout is required.
At least 3 years of experience designing, implementing, and testing electronics circuits required.
Experience simulating the behavior of electronics in Spice, ADS, or similar software is required.
Experience with design and qualification of hardware for military applications

Nice To Haves

Experience with RF & mmW PCB development, layout, and testing is a plus.
Experience with Altium Designer is preferred.
Working knowledge of electronic sub-assemblies from the component to subsystem level, including operation, controls, safety, etc.
A working familiarity with characteristics and tradeoffs of today’s active and passive components and a working knowledge of the availability of COTS components.
Understanding of RF components and devices.
Knowledge of conventional and advanced microelectronic packaging/integration and thermal mgmt.
Familiarity with digital, mixed-signal, power and signal integrity tools are desired.
Familiarity with PCB manufacturing, also standards (IPC 6012, IPC-A-610, Drill tolerancing, etc)
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
Ability to work well in a team and independently.
U.S. Citizenship with the ability to obtain and maintain a US Government security clearance desired.

Responsibilities

Perform preliminary and critical designs based on COTS or custom active and passive parts and components with oversight from a Senior Engineer.
Perform or oversee fabrication and testing with oversight from a Senior Engineer.
Schematic Capture, PCB layout, fabrication documentation and module assembly.
Work with Mechanical Engineering to develop thermal solutions and any mechanical design considerations.