Dry Etch Process Engineer

MACOM Technology Solutions Holdings, Inc.•Lowell, MA

2d•$98,000 - $142,000

About The Position

In this critical role you will be responsible for the Dry Etch processes within MACOM’s internal semiconductor fab. The product portfolio includes GaN, GaAs, Si, and InP based technologies. Responsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as Business Unit design teams. Excellent judgment, a strong knowledge of semiconductor processing, and an optimistic, can-do approach are essential to success in this role.

Requirements

BS or MS degree in Engineering or Physics with at least 5 years of fab experience.
Demonstrated knowledge in semiconductor processes, especially in Dry Plasma Etch and or Descum Process.
Familiarity with typical materials systems for Silicon and/or compound semiconductor.
Strong understanding of semiconductor device physics and IC processing, data mining and statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem solving.
Proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.
Strong sense of ownership, drive and dedication to continuous improvement.
Enthusiastic boldness for taking on aggressive goals and a commitment to achieving them.
Ability to work collaboratively with cross functional teams to improve processes.
Excellent verbal/written communication skills.
Detail-oriented with strong organizational skills.