Dry Etch Process Develop Engineer

Micron • Albany, NY

1d • Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions. As a Dry Etch Process Engineer, you will build, integrate, and optimize plasma etch processes for next-generation memory devices. You will work hands-on with etch equipment, chamber hardware, consumables, and metrology, using data-driven methods to improve critical dimension control, profile, selectivity, uniformity, and defect performance. You will collaborate closely with integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes from R&D into high-volume manufacturing. This role is full-time at the NYC site in Albany, New York, and involves collaboration with the EUV Photo Lithography process team in NYC, as well as Technology Development teams in Boise, USA, and Hiroshima, Japan. The role also supports the design and deployment of AI-enabled solutions. Micron is an equal opportunity employer.

Requirements

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing
• B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch will also be considered
• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity)
• Ability to collaborate effectively across multi-functional technical teams and communicate results clearly
• AI proficiency or AI‑enabled ways of working

Nice To Haves

• Hands-on experience with sophisticated dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets
• Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks)
• Experience with defect characterization techniques and tool health monitoring methodologies
• Experience working with semiconductor equipment vendors, joint development programs, or R&D environments
• Familiarity with technology transfer to high-volume manufacturing and sustaining support in a fab environment

Responsibilities

• Develop, qualify, and sustain dry etch (plasma) unit processes for sophisticated memory technologies (e.g., dielectric, conductor, and hardmask etch)
• Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness
• Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis
• Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures
• Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvements
• Document process baselines, change controls, and learning; communicate results and support the transition of technology to large-scale production

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior