DRAM Process Integration Engineer

Micron TechnologyBoise, ID

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our Advanced DRAM organization and help shape the future of memory technology! We are a team of world class engineers and scientists working in a leading-edge R&D environment to solve some of the industry's most sophisticated semiconductor challenges and to transform breakthrough concepts into manufacturable solutions. As a Process Integration Engineer, you will help define the future of memory technology by identifying novel solutions to scaling, performance, and power challenges in advanced semiconductor devices. You will work with experts in process development, device engineering, modeling, characterization, and reliability to develop and integrate new technologies from concept through implementation in silicon.

Requirements

  • M.S. or PhD in Electrical Engineering, Materials Science, Physics, or a related field
  • Strong expertise in semiconductor device physics and materials science, with understanding of process integration and process development.
  • Experience with data analysis, design of experiments (DOE), and statistical methods
  • Proven ability to lead projects and drive results across functional technical teams

Nice To Haves

  • Experience with cleanroom processing techniques and device fabrication
  • Knowledge of advanced semiconductor manufacturing, characterization techniques, and defect reduction strategies
  • Demonstrated success improving yield, reliability, manufacturability, and cost in semiconductor technologies
  • Experience collaborating with design, product engineering, modeling, characterization, and reliability organizations
  • Experience using AI-assisted analytics to improve data interpretation, anomaly detection, and yield improvement initiatives

Responsibilities

  • Lead integration activities for advanced semiconductor devices, including charge storage devices, thin-film transistors (TFTs), and related device structures
  • Evaluate device operating mechanisms, failure modes, noise sources, and variability to improve device performance and reliability
  • Partner with cross-functional teams to identify and resolve performance, yield, reliability, and product margin challenges
  • Design, implement, and analyze experiments in the R&D fab to optimize process flows and meet product requirements
  • Analyze inline, parametric, and probe data to drive yield improvement, process margin, and cost reduction
  • Communicate sophisticated technical issues and lead teams toward achieving project goals

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service