DRAM Process Integration Engineer

Micron TechnologyBoise, ID

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s ground breaking pathfinding organization, working in an industry-leading R&D facility. Our team of extraordinary engineers develops the breakthrough technologies that enable future memory scaling. We focus on identifying novel, creative solutions to scaling, performance, and power challenges for sophisticated semiconductor devices. As a DRAM Process Integration Engineer, you will drive technology integration activities to enable brand new DRAM architectures. You will own process flows from initial paper conception through productization in silicon, collaborating across multi-functional R&D groups. Your work will directly impact future memory performance, reliability, and device architecture scaling!

Requirements

  • MS or PhD in an engineering or relevant technical field plus 5+ years of relevant semiconductor industry experience.
  • Detailed knowledge of mainstream memory technologies (DRAM, NAND) acquired through proven technical contributions.
  • Strong functional understanding of semiconductor process integration, process development, device physics, and materials science.
  • Meticulous approach to experiment design and data analysis, including theoretical and statistical applications.
  • Proven project management skills with experience leading cross-functional technical teams.

Nice To Haves

  • Familiarity with the circuit and architecture challenges and opportunities facing alternative and 3D memory technologies.
  • Experience collaborating closely with simulation, modeling, characterization, and reliability groups.
  • Demonstrated ability to pioneer novel device components from concept to manufacturing line implementation.
  • Proficiency leveraging AI to improve productivity.

Responsibilities

  • Lead technology integration activities to enable groundbreaking advanced memory devices, focusing on charge storage devices and thin-film transistors (TFTs).
  • Develop and integrate new device architectures from paper conception through productization in silicon.
  • Optimize process flows and implement creative solutions to meet product requirements.
  • Evaluate operating and failure mechanisms, sources of noise, and variability to optimize device performance.
  • Build and complete cleanroom fab experiments by engaging with process development, product engineering, inventing, and yield improvement teams.
  • Drive continuous yield improvement by analyzing inline data, defect data, parametric data, and probe data.
  • Summarize complex technical problems and clearly communicate solutions to both technical and non-technical audiences.

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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