Director Pathfinding Solutions - Integrated Materials Solutions

Applied Materials • Albany, NY

2d • $176,000 - $242,000 • Onsite

About The Position

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

Role Summary
The Director, Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering, device physics, and materials science — working across Applied's product Business Units to assemble and de-risk integrated pathfinding solutions for N+1, N+2 and beyond technology nodes.
This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration — someone who can independently conceive, develop, and demonstrate pathfinding solutions, engage credibly with customer technologists at senior levels, and influence Applied's product roadmaps through deep technical insights. This is not a traditional people management role; it is a technical leadership position that demands world-class expertise, creativity, and execution.

Requirements

• Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline
• 10+ years of experience in semiconductor process development, integration, or device engineering — with deep expertise in FEOL, MOL, or BEOL process technologies
• Demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes
• Strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio
• Experience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs, foundries, memory makers)
• Deep understanding of device physics, process-structure-property relationships, and DTCO principles
• Ability to work effectively across organizational boundaries — coordinating with multiple BUs, product teams, and customer organizations
• Exceptional analytical, problem-solving, and communication skills

Nice To Haves

• Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies
• Track record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designation
• Experience with advanced device architectures including Gate-All-Around (GAA), Complementary FET (CFET), 3D DRAM, or 4F2 DRAM, NAND
• Familiarity with advanced metallization (Mo, Cu, W, etc.), selective processes, and novel patterning approaches
• Prior experience at a leading semiconductor manufacturer in a process integration or device engineering role
• Strong network in the semiconductor technical community

Responsibilities

• Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and / or memory (DRAM 4F2, 3D DRAM, NAND) device architectures
• Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing — connecting individual process steps into integrated module flows
• Identify and de-risk critical process challenges for N+1 and N+2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysis
• Translate customer device performance targets (e.g., contact resistance reduction, carrier mobility enhancement, low-k integration, high-selectivity etch) into actionable Applied process solutions
• Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value
• Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements
• Collaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, NAND)
• Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules
• Engage directly with senior technologists at key customers (Samsung, Intel, TSMC, SK Hynix, Micron etc) as a credible technical peer — presenting data, discussing integration approaches, and aligning on pathfinding priorities
• Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops
• Translate customer integration challenges into Applied-actionable development programs and demo plans
• Support customer co-development engagements by providing deep process expertise and integration guidance
• Publish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfinding
• Build a strong patent portfolio in advanced process integration and pathfinding solutions
• Contribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineers
• Stay at the forefront of semiconductor technology trends — including device architecture evolution, new materials, and emerging integration challenges

Benefits

• Supportive work culture that encourages learning, development, and career growth
• Opportunities to take on challenges and drive innovative solutions
• Empowerment to push boundaries and learn every day
• Programs and support for personal and professional growth
• Care for employees at work, at home, or wherever they may go
• Comprehensive benefits package
• Participation in a bonus program
• Stock award program

What This Job Offers

• Job Type: Full-time
• Career Level: Director
• Education Level: Ph.D. or professional degree