Director Pathfinder Solutions - Integrated Materials Solutions

Applied Materials • Albany, NY

1d • $200,000 - $275,000 • Onsite

About The Position

The Director, Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering, device physics, and materials science — working across Applied's product Business Units to assemble and de-risk integrated pathfinding solutions for N+1, N+2 and beyond technology nodes. This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration — someone who can independently conceive, develop, and demonstrate pathfinding solutions, engage credibly with customer technologists at senior levels, and influence Applied's product roadmaps through deep technical insights. This is not a traditional people management role; it is a technical leadership position that demands world-class expertise, creativity, and execution.

Requirements

• Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline
• 10+ years of experience in semiconductor process development, integration, or device engineering — with deep expertise in FEOL, MOL, or BEOL process technologies
• Demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes
• Strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio
• Experience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs, foundries, memory makers)
• Deep understanding of device physics, process-structure-property relationships, and DTCO principles
• Ability to work effectively across organizational boundaries — coordinating with multiple BUs, product teams, and customer organizations
• Exceptional analytical, problem-solving, and communication skills

Nice To Haves

• Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies
• Track record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designation
• Experience with advanced device architectures including Gate-All-Around (GAA), Complementary FET (CFET), 3D DRAM, or 4F2 DRAM, NAND
• Familiarity with advanced metallization (Mo, Cu, W, etc.), selective processes, and novel patterning approaches
• Prior experience at a leading semiconductor manufacturer in a process integration or device engineering role
• Strong network in the semiconductor technical community

Responsibilities

• Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and / or memory (DRAM 4F2, 3D DRAM, NAND) device architectures
• Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing — connecting individual process steps into integrated module flows
• Identify and de-risk critical process challenges for N+1 and N+2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysis
• Translate customer device performance targets (e.g., contact resistance reduction, carrier mobility enhancement, low-k integration, high-selectivity etch) into actionable Applied process solutions
• Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value
• Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements
• Collaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, NAND)
• Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules
• Engage directly with senior technologists at key customers (Samsung, Intel, TSMC, SK Hynix, Micron etc) as a credible technical peer — presenting data, discussing integration approaches, and aligning on pathfinding priorities
• Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops
• Translate customer integration challenges into Applied-actionable development programs and demo plans
• Support customer co-development engagements by providing deep process expertise and integration guidance
• Publish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfinding
• Build a strong patent portfolio in advanced process integration and pathfinding solutions
• Contribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineers
• Stay at the forefront of semiconductor technology trends — including device architecture evolution, new materials, and emerging integration challenges

Benefits

• supportive work culture that encourages you to learn, develop, and grow your career
• comprehensive benefits package
• participation in a bonus and a stock award program, as applicable

What This Job Offers

• Job Type: Full-time
• Career Level: Director
• Education Level: Ph.D. or professional degree