Director of Electronic Design Automation Product Management, Texas Institute for Electronics

University of Texas at Austin•Austin, TX

6d•Hybrid

About The Position

The Texas Institute for Electronics (TIE) is a well-funded semiconductor foundry venture focused on advancing 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems. This role will lead the implementation, strategy, execution, and team responsible for electronic design automation (EDA) enablement for TIE’s multi-component and chiplet integration platforms. The Director will be hands-on and oversee the development of design kits, simulation tools, and reference flows, working cross-functionally to align roadmaps and ensure scalable deployment across design teams.

Requirements

BS in Electrical Engineering, Computer Engineering, or related discipline.
8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows.
Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous integration.
Experience building and deploying packaged-related PDKs/ADKs and understanding the nuances of modeling, simulation, and qualification across electrical, RF, mechanical, and thermal domains.
Exceptional communication skills. Ability to simplify the complex, create clear deliverables, and build trust with both technical and business audiences.
Startup DNA: Energized by ambiguity, acts with urgency, and takes personal ownership for outcomes.
Execution mindset: Demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
Must be authorized to work in the United States on a full-time basis for any employer without sponsorship.
Relevant education and experience may be substituted as appropriate.

Nice To Haves

MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
Proven program management experience, including end-to-end ownership of programs involving multiple customer or partner stakeholders.
Experience working directly with subcontractors, vendors, and partners to define clear expectations, manage deliverables, and hold teams accountable to milestones.

Responsibilities

Lead the technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verification, and enablement collateral to accelerate customer adoption of TIE’s technologies.
Collaborate closely with TIE subcontractors to clearly define Statements of Work (SoW) in quantifiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed.
Act as a hands-on technical authority for EDA packaging workflows, bridging electrical, thermal, and mechanical simulation domains while leading a team of engineers.
Represent TIE in technical working groups, customer design reviews, and ecosystem partnerships.
Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors (Synopsys, Cadence, Ansys, Siemens) to ensure design enablement flows are aligned, validated, and continuously improved.
Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication.
Create technical documentation and collateral, including user guides, reference flows, and onboarding materials to support customer design teams and strengthen TIE’s position as an EDA innovator.
Monitor EDA market trends and competitive developments, providing actionable insights to guide tool integration, design enablement priorities, and platform differentiation.
Champion a culture of accountability and transparency across all program workstreams—ensuring stakeholders are informed, expectations are managed, and commitments are met.