Director of Analog and Mixed-Signal IC Design

Neurophos • Austin, TX

11d • Onsite

About The Position

Neurophos is seeking a Director of Analog and Mixed-Signal IC Design to build and lead the team responsible for the electronic circuits that drive, sense, and connect our optical processing unit. Our OPU depends on dense, energy-efficient electronics operating in close partnership with photonics: high-speed data converters and drivers that move information into and out of the optical domain, low-power analog front ends that read out the photonic signals, clocking and power management that keep the system stable, and high-bandwidth links that connect it to the rest of the data center. In this role, you will build and run the analog, mixed-signal, and mmWave design organization and own its silicon from architecture through volume production. You will set technical direction, lead and grow a team of senior designers, and be accountable for delivering silicon that meets performance, power, schedule, and yield targets. We are looking for a highly technical leader who has taken multiple products from concept to high-volume manufacturing and knows what it takes to design for first-pass success and production robustness.

Requirements

• 15+ years of experience in analog, mixed-signal, and/or RF IC design, including 5+ years leading design teams at the manager or director level.
• Proven track record of bringing analog/mixed-signal products from concept through tape-out and validation into high-volume production, including qualification, yield ramp, and production test.
• Deep, hands-on expertise in low-power, high-precision analog and high-speed mixed-signal design, including data converters, PLLs, high-speed transceivers, and amplifiers.
• Demonstrated experience with millimeter-wave or high-frequency RF circuit design and the associated EM simulation, modeling, and measurement techniques.
• Strong working knowledge of advanced CMOS, FinFET, and/or SiGe BiCMOS process technologies and their implications for analog performance and reliability.
• Proficiency with industry-standard design and verification flows, including Cadence Virtuoso and Spectre and EM tools such as EMX.
• Experience working with foundries and OSATs, and a solid understanding of DFT, ATE test development, trimming and calibration, and failure analysis.
• Structured, organized approach to running a team and a design flow.
• Adaptable as tools, priorities, and the organization change.

Nice To Haves

• PhD in Electrical Engineering, Computer Engineering, Physics, or related fields.
• Experience designing electronics for integrated photonics or optical interconnects, such as modulator drivers, TIAs, laser drivers, or co-packaged optics.
• Background in electronic-photonic co-design, including heterogeneous integration or 3D stacking of electronic and photonic dies.
• Experience with high-speed (e.g., 112G/224G PAM4 SerDes) wireline standards or mmWave wireless/radar products.
• Experience with ultra-low-power circuit techniques, including subthreshold design, dynamic power management, and energy-efficient data conversion.
• Familiarity with advanced packaging, signal and power integrity, and chip-package-board co-simulation.
• Experience building a team and supporting infrastructure in a startup setting.
• A record of patents, publications, or recognized contributions.

Responsibilities

• Build, lead, and mentor a high-performing team of analog, mixed-signal, RF/mmWave, and layout engineers; recruit top talent and foster a culture of technical rigor, ownership, and collaboration.
• Define the architecture and specifications for analog and mixed-signal IP, including high-speed ADCs and DACs, modulator drivers, transimpedance amplifiers and analog front ends, PLLs and clock generation/distribution, SerDes and high-speed I/O, voltage references, and on-chip regulators.
• Own silicon through the full lifecycle: specification, schematic and layout, verification, tape-out, silicon bring-up, characterization, qualification, and production release.
• Represent analog within the company. Negotiate specifications, schedules, and budgets the team can meet.
• Keep the team informed of company priorities and decisions, and report status, risks, and mitigation plans to the VP of VLSI.
• Guide the design of low-power precision analog blocks and high-speed mixed-signal circuits, driving aggressive energy-per-operation targets across the OPU system.
• Collaborate with the photonics team and oversee the development of millimeter-wave circuits and interfaces, including transceivers, LNAs, PAs, mixers, VCOs, and high-frequency passives, with a focus on EM modeling and package co-design.
• Maintain disciplined design data management.
• Establish and enforce robust design methodologies: PVT and Monte Carlo analysis, reliability (EM/IR, aging, ESD, latch-up), mismatch and noise budgeting, and rigorous design reviews at every milestone.
• Evaluate and adopt new tools, including AI-assisted design and verification.
• Drive design-for-manufacturability and design-for-test, working with test engineering to define strategy, trim and calibration schemes, and production test coverage.
• Lead silicon debug and root-cause analysis, and drive yield improvement and corner-lot correlation with foundry, OSAT, and product engineering partners.
• Partner closely with the photonics, digital, packaging, systems, and firmware teams to co-optimize the electro-optical interface and ensure system-level integration.

Benefits

• 100% coverage of base health plan premiums for you and your dependents, plus HSA contributions.
• Unlimited PTO.
• 401(k) matching and stock option opportunities.
• Full suite of voluntary benefits, including Dental, Vision, Life, Hospital, Critical Illness, and Accident insurance.
• Personalized Benefits: Choose the plans that fit your life and take the cash back for those that don’t.

What This Job Offers

• Job Type: Full-time
• Career Level: Director
• Education Level: Ph.D. or professional degree