2nd Shift Die/Wire Bonder

Mercury Systems•Phoenix, AZ

3h•Onsite

About The Position

Performs basic and routine electronic assembly operations on components or subassemblies. This role involves performing various tasks such as Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, and Chip Shooter/Passive Component Attach. The position requires the ability to set up and operate specific machinery including K&S ICONN Wire bonders, XYZ-Tec, West Bond wire pull equipment, Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers. Responsibilities also include cleaning PCBs, maintaining logs and paperwork, meeting production schedules, and performing a wide variety of electrical/mechanical product assembly operations. The job involves studying assembly instructions, following blueprint specifications, using assembly drawings and related paperwork, and working from written instructions. Daily records must be maintained, and there will be interaction with Engineers and Program Managers. Transaction processing on the Oracle (ERP) system is also a part of this role.

Requirements

Typically requires one year of experience or less.
Ability to work under a microscope for long periods of time.
Strong hand-eye coordination.
Knowledge/ability to read written instructions (assemble, modify, rework, or reassemble units).
Must continuously meet/exceed production schedules and deadlines according to quality standards.
Ability and willingness to operate and multi-task between 2 to 3 machines.
Must be able to train on third shift (9pm - 6:30am).
May occasionally be required to work overtime.
Must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government due to access to information subject to U.S. export regulations.

Nice To Haves

Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach, etc.

Responsibilities

Perform Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.
Set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment.
Set up and run Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers.
Clean PCBs and assemblies throughout the process and after completion.
Maintain logs, paperwork, and forms accurately consistent with company policy and practices.
Continuously meet/exceed production schedules and deadlines according to quality standards.
Performs a wide variety of electrical/mechanical product assembly operations on assemblies.
Prepares assembly work to be accomplished by studying assembly instructions and following blueprint specifications.
Using assembly drawings and related paperwork (Router, Pick List, bill of materials) to accompany parts through production flow.
Using written instructions to assemble, modify, rework, or reassemble units.
Performs basic and routine electronic assembly operations on components or subassemblies.
Maintains daily records and periodically summarizes activities.
Interface with Engineers and Program Managers.
Process transactions on the Oracle (ERP) system.
Other duties as assigned.