Device Integration Intern

MACOM • Lowell, MA

18h

About The Position

MACOM is seeking a motivated Engineering Intern to join its Diodes Integration Engineering team. The 12-week internship provides hands-on exposure to semiconductor process integration, device characterization, yield improvement, and manufacturing engineering, including experience with the semiconductor fabrication flow and cross-functional engineering teams.

The intern will complete a defined engineering project with clear objectives, deliverables, and measurable success criteria; work with experienced engineers and technical mentors; participate in technical training, professional development, networking, and social events; present project results and key learnings at an end-of-program Poster Session; and receive formal performance feedback and career development guidance.

The hourly range is $20–$47. Candidates must be U.S. Persons as defined in the posting: U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status. MACOM is an Equal Opportunity Employer and states that it provides reasonable accommodations to qualified individuals with disabilities.

Requirements

• Currently pursuing a Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics, or a related technical discipline.
• Basic understanding of semiconductor manufacturing and device fundamentals.
• Experience with laboratory, test, or process equipment through coursework, research, or prior internships.
• Familiarity with data analysis, statistics, and engineering problem-solving techniques.
• Must be a U.S. Person: a U.S. citizen, U.S. national, lawful permanent resident, or individual granted asylum or refugee status.

Nice To Haves

• Coursework or project experience in semiconductor fabrication, microelectronics, device physics, or materials characterization.
• Familiarity with semiconductor diodes, PN junctions, or Schottky devices.
• Experience with data analysis tools such as JMP, Python, MATLAB, Minitab, or Excel.
• Knowledge of DOE, SPC, yield analysis, or electrical characterization techniques such as I-V and C-V measurements.
• Strong analytical and problem-solving abilities.
• Strong attention to detail and a data-driven approach to decision making.
• Excellent written and verbal communication skills.
• Ability to work independently while collaborating within multidisciplinary teams.
• Curiosity, initiative, and a continuous improvement mindset.

Responsibilities

• Analyze manufacturing, electrical test, and yield data to identify opportunities for process and device performance improvement.
• Support process integration activities across the semiconductor wafer fabrication flow.
• Investigate relationships between fabrication processes and device electrical performance.
• Support electrical characterization of diode parameters, including forward voltage, leakage, breakdown voltage, resistance, and capacitance.
• Develop and execute Design of Experiments (DOE) and apply Statistical Process Control (SPC) techniques to evaluate process variation and improvements.
• Collaborate with Process, Product, Manufacturing, Reliability, Failure Analysis, Quality, and Test Engineering teams.
• Present technical findings and recommendations to engineering teams and leadership.
• Complete a defined engineering project and present project results and key learnings during the end-of-program Poster Session.

What This Job Offers

• Career Level: Intern
• Education Level: No Education Listed